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Patent Searching and Data


Title:
HIGH REFRACTIVE INDEX RESIN COMPOSITION AND CURED RESIN
Document Type and Number:
WIPO Patent Application WO/2012/053377
Kind Code:
A1
Abstract:
Provided is a high refractive index resin composition for electronic devices which has a high refractive index and is a liquid at any temperature of 0 - 90°C, and which can be used in organic electroluminescence devices, LED devices, or sealing agents or sealants, coating agents, and the like for displays. The present invention provides a high refractive index resin composition for electronic devices characterized by containing a carbazole compound (A) represented by the formula (1) [wherein, R indicates a group (a) that contains at least one reactive functional group selected from a group formed from vinyl groups, epoxy groups, oxetanyl groups, acryloyl groups, and methacryloyl groups]; a compound (B) having one or more of a group (b) containing at least one reactive functional group selected from a group formed from epoxy groups, oxetanyl groups, vinyl ether groups, acryloyl groups, and methacryloyl groups in a single molecule; and a polymerization initiator (C). The composition is also characterized by being a liquid at any temperature of 0 - 90°C.

Inventors:
EGAWA TOMOYA (JP)
ITAYA RYO (JP)
Application Number:
PCT/JP2011/073199
Publication Date:
April 26, 2012
Filing Date:
October 07, 2011
Export Citation:
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Assignee:
DAICEL CORP (JP)
EGAWA TOMOYA (JP)
ITAYA RYO (JP)
International Classes:
C08G59/50; C08F26/00; C09D4/02; C09D163/00; C09K3/10; G02B1/04; G02B1/11; H01L51/50; H05B33/02; H05B33/04
Foreign References:
JP2007277467A2007-10-25
JP2003040940A2003-02-13
JP2010047740A2010-03-04
Attorney, Agent or Firm:
GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)
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Claims: