Title:
HIGH-RIGIDITY ELECTROMAGNETIC SHIELDING COMPOSITION AND MOLDED ARTICLES THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/026652
Kind Code:
A1
Abstract:
The high-rigidity electromagnetic shielding composition of the present invention comprises: (A) approximately 10-34 wt% of polyamide resin having an aromatic group in the backbone structure; (B) approximately 65-85 wt% of carbon fiber; and (C) approximately 1-20 wt% of metallic filler. The composition has high modulus, electromagnetic shielding effects, and high surface conductance, and can thus be used to replace frames, brackets and the like for electronic devices.
Inventors:
LIM YOON SOOK (KR)
PARK KANG YEOL (KR)
SHIN CHAN GYUN (KR)
PARK JEE KWON (KR)
KIM DOO YOUNG (KR)
PARK KANG YEOL (KR)
SHIN CHAN GYUN (KR)
PARK JEE KWON (KR)
KIM DOO YOUNG (KR)
Application Number:
PCT/KR2010/009244
Publication Date:
March 01, 2012
Filing Date:
December 23, 2010
Export Citation:
Assignee:
CHEIL IND INC (KR)
LIM YOON SOOK (KR)
PARK KANG YEOL (KR)
SHIN CHAN GYUN (KR)
PARK JEE KWON (KR)
KIM DOO YOUNG (KR)
LIM YOON SOOK (KR)
PARK KANG YEOL (KR)
SHIN CHAN GYUN (KR)
PARK JEE KWON (KR)
KIM DOO YOUNG (KR)
International Classes:
C08L77/10; C08G69/32; C08J5/04; C08K3/08; C08K7/04
Domestic Patent References:
| WO2003054087A2 | 2003-07-03 |
Foreign References:
| JP2010526888A | 2010-08-05 | |||
| US20060247352A1 | 2006-11-02 | |||
| US4569786A | 1986-02-11 | |||
| US6399737B1 | 2002-06-04 | |||
| US6936191B2 | 2005-08-30 | |||
| US6984342B2 | 2006-01-10 |
Attorney, Agent or Firm:
AJU KIM CHANG & LEE (KR)
특허법인아주양헌 (KR)
특허법인아주양헌 (KR)
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Claims: