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Patent Searching and Data


Title:
HIGH-SPEED MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/153592
Kind Code:
A1
Abstract:
The present invention is a high-speed molding device. According to the present invention, an article (14) may be manufactured by filling resin in a cavity (12) formed by a first mold (10) and a second mold. Gas generated during the filling of the cavity (12) with the resin may be exhausted through a vent unit (20). The vent unit (20) has a first flow path (23) and a second flow path (33) to exhaust the gas, while the resin is allowed to flow up to only the first flow path (23).

Inventors:
PARK JUNG WOO (KR)
LEE DONG WOEN (KR)
CHUNG YOUNG SOO (KR)
CHEON HYEON GWEON (KR)
Application Number:
PCT/KR2022/018188
Publication Date:
August 17, 2023
Filing Date:
November 17, 2022
Export Citation:
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Assignee:
HYOSUNG HEAVY IND CORP (KR)
International Classes:
B29C45/34; B29C45/14; B29C45/17
Foreign References:
KR20140138376A2014-12-04
KR20160142549A2016-12-13
KR102150726B12020-09-02
KR20110023652A2011-03-08
KR101595311B12016-02-18
KR101694204B12017-01-09
KR101326606B12013-11-08
Attorney, Agent or Firm:
NAMCHON PATENT AND LAW FIRM (KR)
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