Title:
HIGH-SPEED SIGNAL CONNECTOR AND RECEPTACLE ASSEMBLY AND TRANSCEIVER MODULE ASSEMBLY EQUIPPED THEREWITH
Document Type and Number:
WIPO Patent Application WO/2019/116516
Kind Code:
A1
Abstract:
In this invention, a contact pad group (20EB), which is formed on the bottom surface (20B) of a connection end section in the base portion of an optical module board (20), is constituted by including, sequentially from one edgemost part, a contact pad (20B1) which establishes a conductive connection to a ground line (G), contact pads (20B2) and (20B3) which establish a conductive connection to a high-speed signal line (S) on the sending side, a contact pad (20B4) which establishes a conductive connection to the ground line (G), contact pads (20B5, 20B6 and, 20B7) which establish conductive connections to a low-speed signal line (S), a contact pad (20B8) which establishes a conductive connection to the ground line (G), contact pads (20B9 and 20B10) which establish a conductive connection to a high-speed signal line (S) on the receiving side, and a contact pad (20B11) which establishes a conductive connection to the ground line (G). In a host connector (30), fixed terminal parts from a plurality of contact terminals (32ai) to be connected to the contact pads (20B2 and 20B3) which establish a conductive connection to the high-speed signal line (S) on the sending side and the contact pads (20B9 and 20B10) which establish a conductive connection to the high-speed signal line (S) on the receiving side are connected electrically, via an electrode part (16BE2), an electrode part (16BE3), an electrode part (16BE9), and an electrode part (16BE10) in a printed wiring board (16), to conductor paths (16THL, 16RHL) which continue into a high-speed signal line formed on a plane that is common to the electrode part (16BE2), the electrode part (16BE3), the electrode part (16BE9), and the electrode part (16BE10).
Inventors:
TAKAI YOSUKE (JP)
ITO TOSHIYASU (JP)
ITO TOSHIYASU (JP)
Application Number:
PCT/JP2017/044956
Publication Date:
June 20, 2019
Filing Date:
December 14, 2017
Export Citation:
Assignee:
YAMAICHI ELECTRONICS CO LTD (JP)
International Classes:
H01R12/73; H01R13/6471
Foreign References:
| JP2015115148A | 2015-06-22 | |||
| JP2007141587A | 2007-06-07 | |||
| JP2013004518A | 2013-01-07 | |||
| JP2016225242A | 2016-12-28 | |||
| JP2002334755A | 2002-11-22 | |||
| JP2015179569A | 2015-10-08 |
Attorney, Agent or Firm:
TANI & ABE, P.C. (JP)
Download PDF:
Previous Patent: RETRIEVAL SYSTEM AND MONITORING SYSTEM
Next Patent: IMAGE PROCESSING DEVICE AND IMAGE PROCESSING METHOD
Next Patent: IMAGE PROCESSING DEVICE AND IMAGE PROCESSING METHOD