Title:
HIGH-STRENGTH HIGH-CONDUCTIVITY COPPER ALLOY ROLLED SHEET AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2010/079707
Kind Code:
A1
Abstract:
Disclosed is a high-strength high-conductivity copper alloy rolled sheet which contains 0.14-0.34 mass% of Co, 0.046-0.098 mass% of P and 0.005-1.4 mass% of Sn, while satisfying the relation between the Co content, that is expressed as [Co] (mass%), and the P content, that is expressed as [P] (mass%), of 3.0 ≤ ([Co] - 0.007)/([P] - 0.009) ≤ 5.9. The high-strength high-conductivity copper alloy rolled sheet has a total cold rolling reduction of not less than 70%, and a recrystallization ratio of not more than 45% after the final deposition heat treatment process. The recrystallized grains have an average crystal grain size of 0.7-7 μm, the deposits have an average grain size of 2.0-11 nm, and the fine crystals have an average grain size of 0.3-4 μm. The area ratio of the fine crystals relative to the entire metal structure is 0.1-25%. Due to the fine deposits of Co, P and the like, solid solution of Sn, and fine crystals, the high-strength high-conductivity copper alloy rolled sheet can have improved strength, electrical conductivity and ductility.
Inventors:
OISHI Keiichiro (4-7-35, Kita-Shinagawa, Shinagawa-k, Tokyo 50, 〒1408550, JP)
Application Number:
JP2009/071599
Publication Date:
July 15, 2010
Filing Date:
December 25, 2009
Export Citation:
Assignee:
Mitsubishi Shindoh CO., Ltd. (4-7-35, Kita-Shinagawa Shinagawa-k, Tokyo 50, 〒1408550, JP)
三菱伸銅株式会社 (〒50 東京都品川区北品川４－７－３５ Tokyo, 〒1408550, JP)
三菱伸銅株式会社 (〒50 東京都品川区北品川４－７－３５ Tokyo, 〒1408550, JP)
International Classes:
C22C9/06; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22F1/08; H01B1/02; H01B5/02; H01B13/00; C22F1/00
Attorney, Agent or Firm:
OHNAKA Minoru et al. (Daiichijuken Nagahoribashi-ekimae bldg. 4F, 3-6 Minamisemba 2-chome, Chuo-k, Osaka-shi Osaka 81, 〒5420081, JP)
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