Title:
HIGH-STRENGTH HIGH-CONDUCTIVITY COPPER ALLOY ROLLED SHEET AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2010/079708
Kind Code:
A1
Abstract:
Disclosed is a low-cost high-strength high-conductivity copper alloy rolled sheet which has an alloy composition that contains 0.14-0.34 mass% of Co, 0.046-0.098 mass% of P, and 0.005-1.4 mass% of Sn with the balance made up of Cu and unavoidable impurities, while satisfying the relation between the Co content, that is expressed as [Co] (mass%), and the P content, that is expressed as [P] (mass%), of 3.0 ≤ ([Co] - 0.007)/([P] - 0.009) ≤ 5.9. In the high-strength high-conductivity copper alloy rolled sheet, deposits are present in the metal structure, and the deposits have a generally circular or generally elliptical shape and an average grain size of 1.5-9.0 nm. Alternatively, not less than 90% of all the deposits are fine deposits having a size of 15 nm or less, and dispersed uniformly. Due to the presence of fine deposits of Co and P, and the solid solution of Sn, the high-strength high-conductivity copper alloy rolled sheet can have improved strength, electrical conductivity and heat resistance.
Inventors:
OISHI keiichiro (4-7-35, Kita-Shinagawa, Shinagawa-k, Tokyo 50, 〒1408550, JP)
Application Number:
JP2009/071606
Publication Date:
July 15, 2010
Filing Date:
December 25, 2009
Export Citation:
Assignee:
Mitsubishi Shindoh CO., Ltd. (4-7-35, Kita-Shinagawa Shinagawa-k, Tokyo 50, 〒1408550, JP)
三菱伸銅株式会社 (〒50 東京都品川区北品川４－７－３５ Tokyo, 〒1408550, JP)
三菱伸銅株式会社 (〒50 東京都品川区北品川４－７－３５ Tokyo, 〒1408550, JP)
International Classes:
C22C9/06; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22F1/08; H01B1/02; H01B5/02; H01B13/00; C22F1/00
Attorney, Agent or Firm:
OHNAKA Minoru et al. (Daiichijuken Nagahoribashi-ekimae bldg.4F, 3-6, Minamisemba 2-chome, Chuo-ku, Osaka-sh, Osaka 81, 〒5420081, JP)
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