Title:
HIGH STRENGTH, HIGH DENSITY CARRIER PLATE
Document Type and Number:
WIPO Patent Application WO/2010/096228
Kind Code:
A3
Abstract:
A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers.
Inventors:
SECOY TODD C (US)
DOUGHERTY DALE S (US)
COLE MIKEL S (US)
GARCIA DOUGLAS J (US)
WERNERT MICHELLE (US)
DOUGHERTY DALE S (US)
COLE MIKEL S (US)
GARCIA DOUGLAS J (US)
WERNERT MICHELLE (US)
Application Number:
PCT/US2010/021556
Publication Date:
October 28, 2010
Filing Date:
January 21, 2010
Export Citation:
Assignee:
ELECTRO SCIENT IND INC (US)
SECOY TODD C (US)
DOUGHERTY DALE S (US)
COLE MIKEL S (US)
GARCIA DOUGLAS J (US)
WERNERT MICHELLE (US)
SECOY TODD C (US)
DOUGHERTY DALE S (US)
COLE MIKEL S (US)
GARCIA DOUGLAS J (US)
WERNERT MICHELLE (US)
International Classes:
B29C33/76; B29C39/10
Foreign References:
| US4102043A | 1978-07-25 | |||
| US4526129A | 1985-07-02 | |||
| US6159407A | 2000-12-12 | |||
| US5894006A | 1999-04-13 |
Attorney, Agent or Firm:
KNIGHT, Michelle L. et al. (PC3001 West Big Beaver Rd., Ste. 62, Troy MI, US)
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