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Title:
HIGH-STRENGTH AND EASY-TO-ELECTROPLATE POLYAMIDE COMPOSITE MATERIAL AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/127417
Kind Code:
A1
Abstract:
A high-strength and easy-to-electroplate polyamide composite material and a preparation method therefor. The polyamide composite material comprises the following components in parts by weight: a polyamide resin, organic modified nano montmorillonite, an inorganic filer, a silane coupling agent, caprolactam, an initiator, an antioxidant, and a lubricant. The preparation method comprises the following steps: adding the polyamide resin, organic modified nano montmorillonite, the inorganic filer, the silane coupling agent, caprolactam, the initiator, the antioxidant, and the lubricant into a mixing and stirring machine for mixing, performing reactive extrusion and blending by means of a twin-screw extruder, and performing granulation to obtain the high-strength and easy-to-electroplate polyamide composite material. The high-strength and easy-to-electroplate polyamide composite material achieves nanoscale uniform dispersion of montmorillonite and the inorganic filer in a polyamide substrate, and can be used as a riveting point during an electroplating roughening process to increase a bonding force between a resin substrate and a metal plating, thereby obtaining a finished piece with a high electroplating bonding force.

Inventors:
WANG, Yao (No. 1399, Jigao RoadHuacao Town, Minhang District, Shanghai 7, 201107, CN)
LI, Qiang (No. 1399, Jigao RoadHuacao Town, Minhang District, Shanghai 7, 201107, CN)
LUO, Minghua (No. 1399, Jigao RoadHuacao Town, Minhang District, Shanghai 7, 201107, CN)
XIN, Minqi (No. 1399, Jigao RoadHuacao Town, Minhang District, Shanghai 7, 201107, CN)
Application Number:
CN2017/119973
Publication Date:
July 04, 2019
Filing Date:
December 29, 2017
Export Citation:
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Assignee:
SHANGHAI KUMHOSUNNY PLASTICS CO., LTD. (No. 1399, Jigao RoadHuacao Town, Minhang District, Shanghai 7, 201107, CN)
International Classes:
C08L77/02; C08K3/26; C08K3/34; C08K5/103; C08K5/134; C08K5/526; C08K7/00; C08K9/04; C08K13/06
Domestic Patent References:
WO2000052079A12000-09-08
Foreign References:
CN101157798A2008-04-09
CN1491990A2004-04-28
CN1354201A2002-06-19
CN106046781A2016-10-26
CN101787204A2010-07-28
Attorney, Agent or Firm:
SHANGHAI HANGSOME INTELLECTUAL PROPERTY LTD. et al. (Room 307, No. 56 Lane 3828, Yindu Road,Minhang District, Shanghai 8, 201108, CN)
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