Title:
HIGH-STRENGTH AND EASY-TO-ELECTROPLATE POLYAMIDE COMPOSITE MATERIAL AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/127417
Kind Code:
A1
Abstract:
A high-strength and easy-to-electroplate polyamide composite material and a preparation method therefor. The polyamide composite material comprises the following components in parts by weight: a polyamide resin, organic modified nano montmorillonite, an inorganic filer, a silane coupling agent, caprolactam, an initiator, an antioxidant, and a lubricant. The preparation method comprises the following steps: adding the polyamide resin, organic modified nano montmorillonite, the inorganic filer, the silane coupling agent, caprolactam, the initiator, the antioxidant, and the lubricant into a mixing and stirring machine for mixing, performing reactive extrusion and blending by means of a twin-screw extruder, and performing granulation to obtain the high-strength and easy-to-electroplate polyamide composite material. The high-strength and easy-to-electroplate polyamide composite material achieves nanoscale uniform dispersion of montmorillonite and the inorganic filer in a polyamide substrate, and can be used as a riveting point during an electroplating roughening process to increase a bonding force between a resin substrate and a metal plating, thereby obtaining a finished piece with a high electroplating bonding force.
Inventors:
WANG YAO (CN)
LI QIANG (CN)
LUO MINGHUA (CN)
XIN MINQI (CN)
LI QIANG (CN)
LUO MINGHUA (CN)
XIN MINQI (CN)
Application Number:
PCT/CN2017/119973
Publication Date:
July 04, 2019
Filing Date:
December 29, 2017
Export Citation:
Assignee:
SHANGHAI KUMHO SUNNY PLASTICS CO LTD (CN)
International Classes:
C08K3/26; C08L77/02; C08K3/34; C08K5/103; C08K5/134; C08K5/526; C08K7/00; C08K9/04; C08K13/06
Domestic Patent References:
WO2000052079A1 | 2000-09-08 |
Foreign References:
CN101157798A | 2008-04-09 | |||
CN1491990A | 2004-04-28 | |||
CN1354201A | 2002-06-19 | |||
CN106046781A | 2016-10-26 | |||
CN101787204A | 2010-07-28 |
Attorney, Agent or Firm:
SHANGHAI HANGSOME INTELLECTUAL PROPERTY LTD. et al. (CN)
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