Title:
HIGH-STRENGTH SOLDERING ALLOY
Document Type and Number:
WIPO Patent Application WO/1994/020257
Kind Code:
A1
Abstract:
A high-strength soldering alloy exhibiting high mechanical strengths and high toughness even under severe conditions. The alloy comprises 0.8-7.0 wt. % of Ag and Ge in total (both of Ag and Ge being contained in an amount of greater than 0 wt. %), 0-3.0 wt. % of Sb, 0-3.0 wt. % of Bi, 30-70 wt. % of Sn, 0-2.5 wt. % of In, and the balance comprising Pb.
Inventors:
KAWAGUCHI TORANOSUKE (JP)
HAYASHI TAKAYUKI (JP)
ROBEEN GENE (JP)
HIYAMA REIKO (JP)
HAYASHI TAKAYUKI (JP)
ROBEEN GENE (JP)
HIYAMA REIKO (JP)
Application Number:
PCT/JP1994/000172
Publication Date:
September 15, 1994
Filing Date:
February 04, 1994
Export Citation:
Assignee:
NIHON ALMIT CO LTD (JP)
KAWAGUCHI TORANOSUKE (JP)
HAYASHI TAKAYUKI (JP)
ROBEEN GENE (JP)
HIYAMA REIKO (JP)
KAWAGUCHI TORANOSUKE (JP)
HAYASHI TAKAYUKI (JP)
ROBEEN GENE (JP)
HIYAMA REIKO (JP)
International Classes:
B23K35/26; (IPC1-7): B23K35/26
Foreign References:
| JPH02187295A | 1990-07-23 | |||
| JPS6182994A | 1986-04-26 | |||
| JPH0275493A | 1990-03-15 | |||
| JPS6272496A | 1987-04-03 | |||
| JPS61273296A | 1986-12-03 | |||
| JPH0328996B2 | 1991-04-22 |
Other References:
See also references of EP 0639426A4
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