Title:
HIGH-STRENGTH TITANIUM-COPPER FOIL, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2014/013876
Kind Code:
A1
Abstract:
Provided is a high-strength titanium-copper foil which is suitable as an electrically conductive spring material that can be used in an electronic device component such as an autofocus camera module. A titanium-copper foil, which comprises Ti in an amount of 1.5 to 5.0 mass% and a remainder made up by copper and unavoidable impurities and has a 0.2% proof stress of 1100 MPa or more as measured in a direction parallel to the rolling direction and an arithmetic average roughness (Ra) of 0.1 μm or less as measured in a direction perpendicular to the rolling direction.
Inventors:
NAGANO MASAYUKI (JP)
KOIKE KENJI (JP)
KOIKE KENJI (JP)
Application Number:
PCT/JP2013/068263
Publication Date:
January 23, 2014
Filing Date:
July 03, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C22C9/00; C22F1/08; C22F1/00
Foreign References:
| JP2012097308A | 2012-05-24 | |||
| JP2010261066A | 2010-11-18 | |||
| JP2011136357A | 2011-07-14 | |||
| JP2007107036A | 2007-04-26 | |||
| JP2005187885A | 2005-07-14 | |||
| JP2009301794A | 2009-12-24 | |||
| JP2010197718A | 2010-09-09 | |||
| JPH06264202A | 1994-09-20 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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