HIGH TEMPERATURE CIRCUITS - HALLIBURTON ENERGY SERV INC

Title:

HIGH TEMPERATURE CIRCUITS

Document Type and Number:

WIPO Patent Application WO2005048664

Kind Code:

B1

Abstract:

Methods and systems for operating integrated circuits (28) at temperatures higher than expected ambient temperatures. The heating may be of entire circuit boards (16), portions of the circuit boards (16), such as the components (30, 32, 34) within a multiple-chip module (28) and/or single devices. Methods and related systems may be used in any high temperature environment such as downhole logging tools (10), and the devices so heated are preferably of silicon on insulator semiconductor technology.

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Inventors:

RODNEY PAUL F (US)
MASINO JAMES E (US)
SCHULTZ ROGER L (US)

Application Number:

PCT/US2004/033678

Publication Date:

November 03, 2005

Filing Date:

October 13, 2004

Export Citation:

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Assignee:

HALLIBURTON ENERGY SERV INC (US)
RODNEY PAUL F (US)
MASINO JAMES E (US)
SCHULTZ ROGER L (US)

International Classes:

E21B36/00; E21B43/24; E21B49/00; H01L23/34; H05K1/02; H05K; (IPC1-7): E21B49/00

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