Title:
HIGH-TEMPERATURE COMPONENT AND METHOD FOR MANUFACTURING HIGH-TEMPERATURE COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/202867
Kind Code:
A1
Abstract:
A high-temperature component according to one embodiment requires cooling performed via a cooling medium, wherein: the high-temperature component comprises a plurality of first cooling passages through which the cooling medium can flow, a header section to which downstream ends of the plurality of first cooling passages are connected, and one or more exit passages for discharging the cooling medium that has flowed into the header section to the outside of the header section; and the degree of roughness of the inner wall surfaces of the one or more exit passages is equal to or less than that of the inner wall surfaces of the plurality of first cooling passages in a region where the flow-channel cross-sectional area of the exit passages reaches a minimum.
Inventors:
TANIGAWA SHUJI (JP)
IIDA KOICHIRO (JP)
ITO RYUTA (JP)
TOKUTAKE TARO (JP)
WAKITA YOSHINORI (JP)
IIDA KOICHIRO (JP)
ITO RYUTA (JP)
TOKUTAKE TARO (JP)
WAKITA YOSHINORI (JP)
Application Number:
PCT/JP2020/006559
Publication Date:
October 08, 2020
Filing Date:
February 19, 2020
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
F02C7/18; F01D25/00; F02C7/00; F02K9/40; F02K9/64
Foreign References:
| JP2015105656A | 2015-06-08 | |||
| US20120057968A1 | 2012-03-08 | |||
| JP2005090512A | 2005-04-07 | |||
| JP2017096616A | 2017-06-01 | |||
| JP2015017608A | 2015-01-29 | |||
| US20160319678A1 | 2016-11-03 |
Attorney, Agent or Firm:
SEISHIN IP PATENT FIRM, P.C. (JP)
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