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Patent Searching and Data


Title:
HIGH TEMPERATURE MEASURING SENSOR ARRANGEMENT
Document Type and Number:
WIPO Patent Application WO/2014/012818
Kind Code:
A3
Abstract:
The invention relates to a high temperature measuring sensor arrangement, comprising a sensor element located in a shield tube with a measuring section exposed at the end of the shield tube and oriented towards the hot side and connections opposite this, facing towards the cold side, with a protective cap connected to the shield tube and enclosing the measuring section and a first stabilizing and fastening sleeve directed towards the hot side. According to the invention, the first stabilizing and fastening sleeve directed towards the hot side overlays the protective cap at the end thereof pointing towards the protective cap and provides stabilization against vibrational forces, wherein on the other hand, thermal expansions in the longitudinal axis direction are absorbed by the joint between the protective cap and the first stabilizing and fastening sleeve. Furthermore, a second stabilizing and fastening sleeve directed towards the cold side is provided, which overlays the shield tube at the connection-side end and supports said tube, wherein the first and/or the second stabilizing and fastening sleeve is designed with a reduced diameter in the region of the joint and overlay.

Inventors:
LANTZSCH, Heiko (Ernst Böckel Str. 17, Eisenach, 99817, DE)
Application Number:
EP2013/064455
Publication Date:
May 22, 2014
Filing Date:
July 09, 2013
Export Citation:
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Assignee:
TESONA GMBH & CO. KG (Am Künkelhof 4, Hörselberg/Hainich, 99819, DE)
International Classes:
G01K1/08
Foreign References:
DE102011083437A12012-07-12
DE202011001280U12012-04-18
Attorney, Agent or Firm:
MEISSNER, BOLTE & PARTNER GBR (Widenmayerstr. 47, München, 80538, DE)
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