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Title:
HIGH-TENSILE, PLASTICALLY DEFORMABLE MOULDED BODY CONSISTING OF TITANIUM ALLOYS
Document Type and Number:
WIPO Patent Application WO2003101697
Kind Code:
A3
Abstract:
The aim of the invention is to provide high-tensile moulded bodies consisting of titanium alloys, which deform plastically at room temperature, said bodies having a macroscopic plasticity compared to metallic glasses, in addition to a deformation reinforcement, without adversely affecting other characteristics, such as friability, elastic extension or corrosion behaviour. The inventive moulded bodies are characterised in that they consist of a material, whose composition corresponds to the formula Tia E1b E2c E3d E4e, in which E1 consists of one or more elements of the group containing Ta, Nb, Mo, Cr, W, Zr, V, Hf and Y, E2 consists of one or more elements of the group containing Cu, Au, Ag, Pd and Pt, E3 consists of one or more elements of the group containing Ni, Co, Fe, Zn, Mn and E4 consists of one or more elements of the group containing Sn, Al, Ga, Si, P, C, B, Pb and Sb, where a = 100-(b+c+d+e), b = 0 to 20, c = 5 to 30, d = 5 to 30, e = 1 to 15 (a, b, c, d, e in atomic %). The moulded bodies have a homogeneous microstructure, consisting primarily of a vitreous or nanocrystalline matrix with a ductile, dendritic body-centred cubic phase embedded therein. A third phase can be present in a reduced volumetric proportion. Moulded bodies of this type can be used as high-stress components, e.g. in the aeronautical industry, space travel and automobile industry, but also for medical technical equipment and implants in the medical field.

Inventors:
HE GUO (DE)
LOESER WOLFGANG (DE)
ECKERT JUERGEN (DE)
KUEHN UTA (DE)
Application Number:
PCT/DE2003/001790
Publication Date:
January 20, 2005
Filing Date:
May 28, 2003
Export Citation:
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Assignee:
LEIBNIZ INST FUER FESTKOERPER (DE)
HE GUO (DE)
LOESER WOLFGANG (DE)
ECKERT JUERGEN (DE)
KUEHN UTA (DE)
International Classes:
C22C14/00; C22C45/10; C23C14/00; B29C; (IPC1-7): C22C14/00
Domestic Patent References:
WO1999049095A11999-09-30
WO2000068469A22000-11-16
Foreign References:
US4637967A1987-01-20
EP0197675A11986-10-15
US5626691A1997-05-06
Other References:
PATENT ABSTRACTS OF JAPAN vol. 0072, no. 73 (C - 198) 6 December 1983 (1983-12-06)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 09 13 October 2000 (2000-10-13)
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 03 3 April 2002 (2002-04-03)
PATENT ABSTRACTS OF JAPAN vol. 0155, no. 00 (C - 0895) 18 December 1991 (1991-12-18)
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 02 29 February 1996 (1996-02-29)
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 02 28 February 1997 (1997-02-28)
PATENT ABSTRACTS OF JAPAN vol. 0186, no. 68 (C - 1289) 16 December 1994 (1994-12-16)
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