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Patent Searching and Data


Title:
HIGH-THERMAL-CONDUCTIVITY INSULATING LAYER MATERIAL, METAL SUBSTRATE, AND PREPARATION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/128895
Kind Code:
A1
Abstract:
The present application relates to a high-thermal-conductivity insulating layer material, a metal substrate, and a preparation method. The preparation method comprises the following steps: first performing photo/electrochemical activation treatment on an inorganic composite micro-nano filler by means of glow discharge plasma, then treating same by means of a coupling agent, and performing spray drying to obtain a pretreated inorganic composite micro-nano filler; dissolving the pretreated inorganic composite micro-nano filler in a solution in which an epoxy resin and a curing agent are located, so as to obtain a resin glue solution; and performing curing treatment on the resin glue solution to form the high-thermal-conductivity insulating layer material, wherein the inorganic composite micro-nano filler is compound powder of a thermally conductive filler and mica powder. The high-thermal-conductivity insulating layer material prepared by the present invention has a beneficial insulating property and thermal conductivity, can satisfy the requirement of heat dissipation of high-power components, and can ensure the lasting and safe operation of electrical and electronic equipment at the same time.

Inventors:
TIAN FUQIANG (CN)
ZHOU LUBIN (CN)
LIU YANTING (CN)
XIA YU (CN)
Application Number:
PCT/CN2020/110976
Publication Date:
July 01, 2021
Filing Date:
August 25, 2020
Export Citation:
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Assignee:
SUZHOU JUFENG ELECTRICAL INSULATION SYSTEM CO LTD (CN)
International Classes:
C08L63/00; C08K9/00; C08K13/06
Foreign References:
CN111154227A2020-05-15
CN104479291A2015-04-01
CN110066577A2019-07-30
US20090111948A12009-04-30
KR20090084835A2009-08-05
CN107541013A2018-01-05
CN102464934A2012-05-23
CN105860437A2016-08-17
CN108690324A2018-10-23
Attorney, Agent or Firm:
SUZHOU JINHE INTELLECTUAL PROPERTY AGENCY (SPECIAL GENERAL PARTNERSHIP) (CN)
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