HIGH THERMAL CONDUCTIVITY INSULATING MEMBER AND ITS MANUFACTURING METHOD, ELECTROMAGNETIC COIL, AND ELECTROMAGNETIC DEVICE

Title:

HIGH THERMAL CONDUCTIVITY INSULATING MEMBER AND ITS MANUFACTURING METHOD, ELECTROMAGNETIC COIL, AND ELECTROMAGNETIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2004/006271

Kind Code:

A1

Abstract:

A tape- or sheet-shaped high thermal conductivity insulating member, its manufacturing method, an electromagnetic coil comprising the high thermal conductivity insulating member, and an electromagnetic device such as a power generator having the electromagnetic coil. It is necessary to improve the cooling performance of an electromagnetic coil of an electric device so as to enhance the efficiency and to reduce the size and manufacturing cost. For the enhancement, it has been tried to increase the thermal conductivity of a tape- or sheet-shaped insulating member of the electromagnetic coil. However, there have been problems that the thermal conductivity of conventional insulating members has been insufficient, and only special resin components can be used. To solve the above problems, according to the invention, the tape- or sheet-shaped insulating member is made of a material such that first particles having a thermal conductivity of 1 to 300 W/mK and second particles having a thermal conductivity of 0.5 to 300 W/mK are dispersed in a resin base.

Inventors:

OKAMOTO TETSUSHI (JP)
TSUCHIYA HIROYOSHI (JP)
SAWA FUMIO (JP)
IWATA NORIYUKI (JP)
KOYAMA MITSUHIKO (JP)
SUZUKI YUKIO (JP)
SUZUKI AKIHIKO (JP)
OOTAKA TOORU (JP)
ISHII SHIGEHITO (JP)
NAGANO SUSUMU (JP)

Application Number:

PCT/JP2003/008564

Publication Date:

January 15, 2004

Filing Date:

July 04, 2003

Export Citation:

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Assignee:

TOSHIBA KK (JP)
OKAMOTO TETSUSHI (JP)
TSUCHIYA HIROYOSHI (JP)
SAWA FUMIO (JP)
IWATA NORIYUKI (JP)
KOYAMA MITSUHIKO (JP)
SUZUKI YUKIO (JP)
SUZUKI AKIHIKO (JP)
OOTAKA TOORU (JP)
ISHII SHIGEHITO (JP)
NAGANO SUSUMU (JP)

International Classes:

H01F27/22; H01F41/12; H01F5/06; H01F27/32; (IPC1-7): H01B3/00; H01B17/60; H01B19/00; H01F5/06; H01F27/32

Domestic Patent References:

WO2001016965A1	2001-03-08
WO1999066515A1	1999-12-23

Foreign References:

JP2000297204A	2000-10-24
JP2001061247A	2001-03-06
JP2000294061A	2000-10-20
JPH0945133A	1997-02-14
JPS55147753U	1980-10-23
JPS63105412A	1988-05-10
JP2002118997A	2002-04-19
JPH1169687A	1999-03-09
JPS6130041U	1986-02-22

Other References: