HIGH THERMAL CONDUCTIVITY MATERIALS ALIGNED WITHIN RESINS

Title:

HIGH THERMAL CONDUCTIVITY MATERIALS ALIGNED WITHIN RESINS

Document Type and Number:

WIPO Patent Application WO2005124790

Kind Code:

A3

Abstract:

In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrix 32 a high thermal conductivity filler 30. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the fillers have an aspect ratio of between 3-100. The fillers are substantially evenly distributed through the host resin matrix, and are aligned in essentially the same direction. In some embodiments the resins are highly structured resin types

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Inventors:

SMITH JAMES DAVID BLACKHALL (US)
STEPHENS GARY (GB)
WOOD JOHN WILLIAM (US)

Application Number:

PCT/US2005/021217

Publication Date:

February 02, 2006

Filing Date:

June 15, 2005

Export Citation:

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Assignee:

SIEMENS POWER GENERATION INC (US)
SMITH JAMES DAVID BLACKHALL (US)
STEPHENS GARY (GB)
WOOD JOHN WILLIAM (US)

International Classes:

H01B3/00; C08K3/00; C08K3/22; C08K3/28; C08K7/00; C08L101/00

Domestic Patent References:

WO2003040445A1	2003-05-15
WO1999026286A1	1999-05-27

Foreign References:

EP1220240A1	2002-07-03
EP1384567A1	2004-01-28

Other References:

PATENT ABSTRACTS OF JAPAN vol. 015, no. 474 (C - 0890) 3 December 1991 (1991-12-03)

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