Title:
HIGH-THICKNESS MULTILAYER POLYIMIDE FILM AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/169193
Kind Code:
A1
Abstract:
The present invention provides: a multilayer polyimide film having a thickness of at least 50 μm, and including at least two polyimide unit films comprising a polyimide core layer and adhesive layers laminated on one or both surfaces of the polyimide core layer, wherein the at least two polyimide unit films are adhered and laminated through the adhesive layers; and a method for producing same.
Inventors:
WON DONG-YOUNG (KR)
KIM KYUNG-SU (KR)
MIN JAE-HO (KR)
KIM KYUNG-SU (KR)
MIN JAE-HO (KR)
Application Number:
PCT/KR2022/001437
Publication Date:
August 11, 2022
Filing Date:
January 27, 2022
Export Citation:
Assignee:
PI ADVANCED MAT CO LTD (KR)
International Classes:
B32B27/28; B32B7/12; C01B32/205; C08J5/18; C09J7/25; C09J179/08
Foreign References:
| JP2019202514A | 2019-11-28 | |||
| JP2017114098A | 2017-06-29 | |||
| KR101899098B1 | 2018-09-14 | |||
| US20170152348A1 | 2017-06-01 | |||
| KR20200049487A | 2020-05-08 |
Attorney, Agent or Firm:
HANYANG PATENT FIRM (KR)
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