Title:
HIGH VACUUM SUCTION CASTING METHOD AND APPARATUS
Document Type and Number:
WIPO Patent Application WO/2008/108040
Kind Code:
A1
Abstract:
This invention provides a casting method and apparatus, which can manufacture
high-quality castings substantially without gas, oxide film, and other entrainment
defects in a cost-effective and energy saving manner. Specifically, a seal plate
comprising a seal part, an opening part, and a groove for evacuation is disposed
between a pouring gate in a mold gap part and a stalk. The pouring gate is sealed,
and the mold gap part is evacuated. Next, the inside of the stalk is evacuated
through an evacuation groove provided on the lower face of the seal plate to suck
a molten metal. When the molten metal has entered the evacuation groove, the
opening part in the seal plate is moved to between the pouring gate and the stalk
and the mold gap part is filled with the molten metal by taking advantage of a difference
in pressure between the mold gap part and the molten metal in the stalk. A consumption-type
seal formed of the same material as the molten metal may also be used as the seal
for the pouring gate. Upon filling of the mold gap part with the molten metal,
the seal plate is immediately moved to close the pouring gate, and an external
atmospheric pressure is allowed to act on the surface of the molten metal in the
stalk through an outside air venting hole, whereby the molten metal is dropped
within a holding furnace. Further, if necessary, an unsolidified molten metal
in the mold gap part is pressurized.
More Like This:
| JP05096355 | CASTING APPARATUS |
| JP03071969 | REDUCED PRESSURE SUCTION CASTING APPARATUS |
| JP58055167 | VACUUM CASTING DEVICE |
Inventors:
OHNAKA, Itsuo (32-12, Higashitoyonaka-cho 1-chome Toyonaka-sh, Osaka 03, 5600003, JP)
Application Number:
JP2007/073637
Publication Date:
September 12, 2008
Filing Date:
November 30, 2007
Export Citation:
Assignee:
IE SOLUTION CORPORATION (285-4-101, Kamishinden 1-chome Toyonaka-sh, Osaka 85, 5600085, JP)
アイ・イー・ソリューション株式会社 (〒85 大阪府豊中市上新田１丁目２８５番４－１０１号 Osaka, 5600085, JP)
アイ・イー・ソリューション株式会社 (〒85 大阪府豊中市上新田１丁目２８５番４－１０１号 Osaka, 5600085, JP)
International Classes:
B22D18/06; B22D18/04; B22D18/08; B22D18/06; B22D18/00; B22D18/04
Download PDF:
Previous Patent: LED BACKLIGHT AND LIQUID CRYSTAL DISPLAY
Next Patent: SURFACE INSPECTING METHOD AND DEVICE
Next Patent: SURFACE INSPECTING METHOD AND DEVICE