Title:
HIGH-VOLTAGE FLIP-CHIP LED LIGHT SOURCE, LARGE-AREA LED LIGHT SOURCE PACKAGING STRUCTURE AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/008457
Kind Code:
A1
Abstract:
A high-voltage flip-chip LED light source, a large-area LED light source packaging structure and packaging method, wherein the large-area LED light source packaging structure comprises a first substrate (10), a first LED chip (20) and a heat conductive connecting structure (30) arranged between the first LED chip (20) and the first substrate (10), the heat conductive connecting structure (30) comprises a plurality of insulating heat conductors (31) arranged at intervals. The high-voltage flip-chip LED light source comprises a second substrate (1) and a second LED chip (2), wherein a third surface (201) of the second LED chip (2) is provided with an electrode, a fourth surface (202) is a light emitting surface, at least one boss (11) is formed on the surface of the second substrate (1), and the third surface (201) of the at least one second LED chip (2) is connected with the top end surface of the boss (11) through an insulating heat conductive connecting adhesive (3). The large-area LED light source packaging structure solves the problem of uneven heat dissipation caused by warping of the first LED chip (20) in a large area; the second LED chip (2) in the high-voltage flip-chip LED light source can be seamlessly combined with the second substrate (1), and can avoid the problem that the insulating heat conductive connecting adhesive (3) overflows to the conductive electrode.
Inventors:
TANG WENTING (CN)
CAI YONG (CN)
CAI YONG (CN)
Application Number:
PCT/CN2020/101342
Publication Date:
January 21, 2021
Filing Date:
July 10, 2020
Export Citation:
Assignee:
SUZHOU INST NANO TECH & NANO BIONICS SINANO CAS (CN)
International Classes:
H01L25/075; H01L33/54; H01L33/64
Foreign References:
| CN210200726U | 2020-03-27 | |||
| CN210200756U | 2020-03-27 | |||
| CN106981550A | 2017-07-25 | |||
| JP2015046495A | 2015-03-12 | |||
| US20100139767A1 | 2010-06-10 | |||
| CN104576907A | 2015-04-29 |
Attorney, Agent or Firm:
NANJING LI&FENG INTELLECTUAL PROPERTY AGENCY(SPECIAL GENERAL PARTNERSHIP) (CN)
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