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Patent Searching and Data


Title:
HIGHLY ELECTRICALLY CONDUCTIVE AND HIGH STRENGTH COPPER ALLOY AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/124837
Kind Code:
A1
Abstract:
The present invention relates to a copper alloy used as a material for industrial devices, electronic device parts, automobile parts, and thermal management device parts, and a method of manufacturing the same, and the objective of the present invention is to provide a high strength copper alloy having high electrical conductivity and a method for manufacturing the same. According to a preferred embodiment of the present invention, provided are a highly electrically conductive and high strength copper alloy, and a manufacturing method thereof, the copper alloy comprising: a fine Fe crystallization phase inside a supersaturated Cu matrix, and including fine Cu particles inside a supersaturated Fe crystallization phase, wherein the Fe crystallization phase has an aspect ratio of 4 or more.

Inventors:
PARK WOO-JIN (KR)
KWON KI-HYUK (KR)
OH YOON-SUK (KR)
PARK EON-BYEONG (KR)
PARK JAE-SIN (KR)
Application Number:
PCT/KR2018/015493
Publication Date:
June 27, 2019
Filing Date:
December 07, 2018
Export Citation:
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Assignee:
POSCO (KR)
RES INST IND SCIENCE & TECH (KR)
International Classes:
H01B1/02; C22C9/00; C22F1/08
Foreign References:
JP2017193765A2017-10-26
JP2015175056A2015-10-05
KR20130075393A2013-07-05
KR20130136183A2013-12-12
KR20170033921A2017-03-28
Attorney, Agent or Firm:
C&S PATENT AND LAW OFFICE (KR)
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