HIGHLY FLOWABLE POLYAMIDE RESIN - SUMITOMO ELECTRIC INDUSTRIES

Title:

HIGHLY FLOWABLE POLYAMIDE RESIN

Document Type and Number:

WIPO Patent Application WO/2016/009821

Kind Code:

A1

Abstract:

A highly flowable polyamide resin for which the viscosity at a shear rate of 1 s-1 at 150°C is not more than 10 Pa∙s and the viscosity at a shear rate of 1 s-1 at 125°C is at least 100 Pa∙s, the resin having a low viscosity such that the resin can penetrate easily into a wire harness element wire at thermal contraction temperatures while attaining a high viscosity such that resin flow does not occur at temperatures at which the wire harness is used. In particular, a highly flowable polyamide resin wherein: an acid component (a) having a polymerized fatty acid, which comprises a C16-48 dimer acid and in which the content of said dimer acid is at least 30 mass%, as the main component, an acid component (b), which has a dibasic acid selected from a group consisting of C6-22 dicarboxylic acids and ester derivatives thereof as the main component, and an amine component (c), which has a diamine as the main component, are connected by amides bonds; and the mass ratio of the acid component (a) to the acid component (b) is within a prescribed range.

Inventors:

FUKUMOTO RYOTA (JP)
YAMASAKI SATOSHI (JP)
NISHIKAWA SHINYA (JP)
YABE YUUKI (JP)
FUJITA RYOHEI (JP)
MATSUOKA SACHIKO (JP)
FUJIWARA YASUHIRO (JP)

Application Number:

PCT/JP2015/068702

Publication Date:

January 21, 2016

Filing Date:

June 29, 2015

Export Citation:

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELEC FINE POLYMER INC (JP)

International Classes:

C08G69/34

Foreign References:

JP2012233082A	2012-11-29
JP2012031261A	2012-02-16
JPS62297326A	1987-12-24
JP2005213383A	2005-08-11
JP2013505307A	2013-02-14
US4191669A	1980-03-04
JP2008045036A	2008-02-28
JPH04253727A	1992-09-09

Other References: