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Patent Searching and Data


Title:
HIGHLY LOADED INORGANIC FILLED AQUEOUS RESIN SYSTEMS
Document Type and Number:
WIPO Patent Application WO/2019/108808
Kind Code:
A3
Abstract:
This disclosure provides A resin system comprising (1) a resin including (i) 1-30 wt% of a binder comprising an aqueous-soluble, photopolymerizable monomer, oligomer, or polymer, (ii) 1-20 wt% of an emulsion component; and (ii) from greater than 0 to 10 wt% of a photoinitiator; and (2) 41-90 wt% of a filler including glass or glass ceramic particles wherein the particles have an average size along their longest dimension of from 5 nm to 20 μm.

Inventors:
COOK, Laura Beth (2850 Northwood Circle, Corning, New York, 14830, US)
CUNNEEN, Laura Jeanne (875 Soules Road, Lawrenceville, Pennsylvania, 16929, US)
Application Number:
US2018/063084
Publication Date:
July 25, 2019
Filing Date:
November 29, 2018
Export Citation:
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Assignee:
CORNING INCORPORATED (One Riverfront Plaza, Corning, New York, 14831, US)
International Classes:
C08K7/20; B33Y10/00; B33Y70/00; C08F2/50; C08F220/56; C08F226/10; C08K3/34; C08K3/36; C08K3/40
Domestic Patent References:
WO2004074328A12004-09-02
Foreign References:
US6117612A2000-09-12
US20090137771A12009-05-28
US20100022676A12010-01-28
US20150290610A12015-10-15
Attorney, Agent or Firm:
BEAN, Gregory V. (Corning Incorporated, Intellectual Property DepartmentSP-TI-03-, Corning New York, 14831, US)
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