Title:
HIGHLY THERMALLY CONDUCTIVE COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/221826
Kind Code:
A1
Abstract:
Provided is a highly thermally conductive composite material which is excellent in terms of heat resistance and thermal conductivity. The highly thermally conductive composite material is for thermal conduction applications and is obtained by incorporating a thermally conductive filler having a thermal conductivity of 20 W·m-1·K-1 or greater into a resin. The resin is a phenyl-modified polydimethylsiloxane-based hybrid polymer comprising a product of the reaction of the following prepolymers (A) and (B). The prepolymer (A) is a phenyl-modified hybrid prepolymer which comprises a product of condensation of a polydimethylsiloxane having silanol groups at both terminals with a phenyltrialkoxysilane, and the prepolymer (B) is a phenyl-modified hybrid prepolymer which comprises a product of hydrolysis/condensation of a polydimethylsiloxane having trialkoxysilyl groups at both terminals with a phenyltrialkoxysilane and a diphenyldialkoxysilane.
Inventors:
SHINDO TAKUYA (JP)
SATO MIDORI (JP)
TEZUKA HIROSHIGE (JP)
SETO SHOTA (JP)
YAMAMURA TAKASHI (JP)
SATO MIDORI (JP)
TEZUKA HIROSHIGE (JP)
SETO SHOTA (JP)
YAMAMURA TAKASHI (JP)
Application Number:
PCT/JP2017/022298
Publication Date:
December 28, 2017
Filing Date:
June 16, 2017
Export Citation:
Assignee:
NIHON YAMAMURA GLASS CO LTD (JP)
FURUKAWA DENSHI CO LTD (JP)
FURUKAWA DENSHI CO LTD (JP)
International Classes:
C09K5/14; C08L83/04; C08L83/10
Domestic Patent References:
| WO2015194158A1 | 2015-12-23 |
Foreign References:
| JP2007116139A | 2007-05-10 | |||
| JP2016003317A | 2016-01-12 | |||
| JP2013175762A | 2013-09-05 | |||
| JP2006206721A | 2006-08-10 | |||
| JP2005209955A | 2005-08-04 | |||
| JPH061911A | 1994-01-11 |
Attorney, Agent or Firm:
AKAOKA Kazuo et al. (JP)
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