HIGHLY-THERMALLY-CONDUCTIVE POLYCARBONATE RESIN COMPOSITION AND MOLDED BODY

Title:

HIGHLY-THERMALLY-CONDUCTIVE POLYCARBONATE RESIN COMPOSITION AND MOLDED BODY

Document Type and Number:

WIPO Patent Application WO/2012/011356

Kind Code:

A1

Abstract:

Disclosed is a highly-thermally-conductive polycarbonate resin composition of which the thermal conductivity, as well as the insulation performance and fire resistance have been improved. Further disclosed is a molded body thereof. The highly-thermally-conductive polycarbonate resin composition is formed by containing, (A) for every 100 masses of a resin component having a polycarbonate resin as the primary component, (B) at least 5 and no greater than 100 masses of a carbon fiber that is formed by graphitization, has a thermal conductivity in the longitudinal direction of at least 100 W/m·K, and an average fiber diameter of 5-20 µm, and at least 5 masses and no greater than 200 masses of glass beads having an average particle size of 1-100 µm and a spherical deviation of 1-2.

Inventors:

KIKUCHI TATSUYA (JP)
NAGASHIMA HIROMITSU (JP)

Application Number:

PCT/JP2011/064362

Publication Date:

January 26, 2012

Filing Date:

June 23, 2011

Export Citation:

Click for automatic bibliography generation Help

Assignee:

MITSUBISHI ENG PLASTICS CORP (JP)
KIKUCHI TATSUYA (JP)
NAGASHIMA HIROMITSU (JP)

International Classes:

C08L69/00; C08K5/521; C08K7/02; C08K7/20; C08L27/18

Foreign References:

JP2007099799A	2007-04-19
JPH1149937A	1999-02-23
JP2007031611A	2007-02-08
JPH07324143A	1995-12-12
JP2011016936A	2011-01-27
JP2005320515A	2005-11-17
JP2000143826A	2000-05-26
JP2010164082A	2010-07-29
JP2010174978A	2010-08-12

Other References: