Title:
HIGHLY THERMALLY CONDUCTIVE POLYIMIDE FILM COMPRISING TWO OR MORE TYPES OF FILLERS
Document Type and Number:
WIPO Patent Application WO/2019/143000
Kind Code:
A1
Abstract:
The present invention provides a polyimide film comprising a thermally conductive filler and a base film, wherein the thermally conductive filler comprises a first thermally conductive filler having an average diameter of 0.001-20 μm and a second thermally conductive filler having an average diameter of 0.1-20 μm, the first thermally conductive filler is a carbon-based filler or a boron-based filler, the second thermally conductive filler is a metal oxide-based filler, the base film is manufactured through imidization of a polyamic acid formed by a reaction of a dianhydride monomer and a diamine monomer, and the polyimide film has a thickness direction thermal conductivity of 0.5 W/m·K or more and a planar direction thermal conductivity of 2.0 W/m·K or more.
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Inventors:
OH JI YOUNG (KR)
CHO SUNG IL (KR)
LEE KIL NAM (KR)
CHOI JEONG YEUL (KR)
CHO SUNG IL (KR)
LEE KIL NAM (KR)
CHOI JEONG YEUL (KR)
Application Number:
PCT/KR2018/011401
Publication Date:
July 25, 2019
Filing Date:
September 27, 2018
Export Citation:
Assignee:
SKCKOLONPI INC (KR)
International Classes:
C08J5/18; C08G73/10; C08K3/04; C08K3/22; C08K3/38; C08L79/08
Foreign References:
| KR20110051263A | 2011-05-17 | |||
| JP2004123867A | 2004-04-22 | |||
| JP2011211190A | 2011-10-20 | |||
| KR20100125324A | 2010-11-30 | |||
| JP2010275394A | 2010-12-09 |
Attorney, Agent or Firm:
LEE & KO IP (KR)
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