Title:
HIGHLY-THERMALLY-CONDUCTIVE RESIN COMPOSITION, AND RESIN MATERIAL FOR HEAT DISSIPATION/HEAT TRANSFER AND THERMALLY CONDUCTIVE FILM COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2015/083523
Kind Code:
A1
Abstract:
The present invention relates to a resin composition that can be processed into a molded article that has excellent thermal conductivity and is thin and flexible, and relates to a resin material for heat dissipation/heat transfer and a thermally conductive film that contain said resin composition. The resin composition is characterized by comprising 40-60 mol% of a unit (A) having a biphenyl group, and 5-40 mol% of straight-chain units (B) and (C) respectively, and is further characterized by containing a resin having a thermal conductivity of at least 0.4 W/(m·K) in the resin alone, and an inorganic filling material having a thermal conductivity of at least 1W/(m·K).
Inventors:
YOSHIHARA SHUSUKE (JP)
UBUKATA SYOJI (JP)
MATSUMOTO KAZUAKI (JP)
UBUKATA SYOJI (JP)
MATSUMOTO KAZUAKI (JP)
Application Number:
PCT/JP2014/080115
Publication Date:
June 11, 2015
Filing Date:
November 13, 2014
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L67/02; C08K3/00
Domestic Patent References:
| WO2002094905A1 | 2002-11-28 | |||
| WO2006120993A1 | 2006-11-16 | |||
| WO2010050202A1 | 2010-05-06 | |||
| WO2011132389A1 | 2011-10-27 | |||
| WO2011132390A1 | 2011-10-27 |
Foreign References:
| JP2013170202A | 2013-09-02 | |||
| JP2013221117A | 2013-10-28 | |||
| JP2010037474A | 2010-02-18 | |||
| JPH08113719A | 1996-05-07 | |||
| JP2011231159A | 2011-11-17 | |||
| JP2008150525A | 2008-07-03 |
Other References:
MACROMOLECULES, vol. 17, 1984, pages 2288
"Techniques and applications of polymer flame retardation", CMC PUBLISHING CO., LTD., pages: 149 - 221
"Techniques and applications of polymer flame retardation", CMC PUBLISHING CO., LTD., pages: 149 - 221
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation HARAKENZO WORLD PATENT & TRADEMARK (JP)
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