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Patent Searching and Data


Title:
HOLDER FOR A SEMICONDUCTOR SUBSTRATE, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING SUCH A HOLDER
Document Type and Number:
WIPO Patent Application WO1999018599
Kind Code:
A3
Abstract:
The invention relates to a holder (10) for a semiconductor substrate (1) comprising a main body (2) which is provided with three or more projections (3) by means of which the substrate (1) can be held fixed in the holder (10). Two projections (3A, 3B) are fixedly connected, and a third projection (3C) present opposite the other two (3A, 3B) is movably connected to the main body (2). The third projection (3C) can be moved away from the other two (3A, 3B) and is urged towards the latter two by means (4). According to the invention, a lateral side (5) of each projection (3) facing towards the substrate (1) to be inserted is provided with a convex recess (6) whose geometry is such that exclusively the outermost edges of both the upper surface and the lower surface of the substrate (1) to be inserted come into contact with the convex recess (6). A substrate (1), for example a round substrate, can be satisfactorily fastened in such a holder (10) while still its entire surface area can be processed. Given a suitable placement of the projections (3), fluctuations in diameter and thickness of the substrate (1) to be inserted are compensated for. The projections (3) have a diabolo shape in a preferred embodiment. The accessibility of the substrate (1) is substantially optimized by this. In addition, such a holder (10) can be simply and inexpensively manufactured. A holder (10) according to the invention is particularly suitable for treatments of the semiconductor substrate (1) as part of the manufacture of semiconductor devices such as diodes, in particular in steps such as the provision or removal of a (semi)conducting or insulating layer.

Inventors:
TYVELEIJN JOHANNES HENDRIKUS
Application Number:
PCT/IB1998/001419
Publication Date:
July 08, 1999
Filing Date:
September 14, 1998
Export Citation:
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Assignee:
KONINKL PHILIPS ELECTRONICS NV (NL)
PHILIPS SVENSKA AB (SE)
International Classes:
H01L21/00; H01L21/687; H01L21/683; (IPC1-7): H01L21/68; C30B35/00
Foreign References:
US4971676A1990-11-20
Other References:
PATENT ABSTRACTS OF JAPAN, Vol. 11, No. 59; & JP 61220351 A (HITACHI LTD) 30 Sept. 1986.
PATENT ABSTRACTS OF JAPAN, Vol. 7, No. 276; & JP 58155736 A (NIPPON DENKI KK) 16 Sept. 1983.
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