TECHNICAL FIELD OF THE INVENTION

[0001] Embodiments of the present invention relate to a holding arrangement for holding a substrate during a vacuum process, e.g., layer deposition. Embodiments of the present invention particularly relate to a holding arrangement for holding a substrate during vacuum layer deposition.

BACKGROUND OF THE INVENTION

[0002] Several methods are known for depositing a material on a substrate. For instance, substrates may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a plasma enhanced chemical vapor deposition (PECVD) process etc. Typically, the process is performed in a process apparatus or process chamber, where the substrate to be coated is located. A deposition material is provided in the apparatus. A plurality of materials, but also oxides, nitrides or carbides thereof, may be used for deposition on a substrate. Further, other processing steps like etching, structuring, annealing, or the like can be conducted in processing chambers.

[0003] Coated materials may be used in several applications and in several technical fields. For instance, an application lies in the field of microelectronics, such as generating semiconductor devices. Also, substrates for displays are often coated by a PVD process. Further applications include insulating panels, organic light emitting diode (OLED) panels, substrates with TFT, color filters or the like.

[0004] Typically, glass substrates can be supported on carriers during processing thereof. A carrier supports the glass or the substrate and is driven through the processing machine. The carriers typically form a frame or a plate, which supports a surface of the substrate along the periphery thereof or, in the latter case, supports the surface as such. Particularly, a frame shaped carrier can also be used to mask a glass substrate, wherein the aperture in the carrier, which is surrounded by the frame, provides an aperture for coating material to be deposited on the exposed substrate portion or an aperture for other processing steps acting on the substrate portion, which is exposed by the aperture.

[0005] The carrier is driven through the processing machine by a conveying system. Typically, the conveying system includes rollers on which the carrier is placed, so that the carrier is moved along a conveying path by a rotation of the rollers. During conveying, abrasion or wear can occur at the contact areas between the carrier and the rollers. This might cause an undesired generation of particles, leading to a contamination effect during the deposition process. As a result, a deterioration of a quality of the deposited layers may occur.

[0006] In view of the above, it is an object to provide a holding arrangement, particularly a holding arrangement for holding a substrate during vacuum layer deposition, which overcomes at least some of the problems in the art.

SUMMARY OF THE INVENTION

[0007] In light of the above, a holding arrangement for holding a substrate during a vacuum process according to independent claim 1, a system for conveying such a holding arrangement according to independent claim 13, an apparatus for deposition of a layer on a substrate and a method for conveying the holding arrangement are provided. Further aspects, advantages, and features of the present invention are apparent from the dependent claims, the description, and the accompanying drawings.

[0008] According to one embodiment, a holding arrangement for holding a substrate during a vacuum process is provided. The holding arrangement includes a frame having one or more frame elements, and one or more contact interfaces provided at one or more of the frame elements and configured for contacting one or more conveying rollers of a conveying system, wherein a Shore D hardness of a material of the one or more contact interfaces is in the range of 85 to 90. [0009] According to another aspect, a system for conveying the above holding arrangement is provided. The system includes the conveying rollers configured to contact the one or more contact interfaces of the holding arrangement for conveying the holding arrangement. [0010] According to still another aspect, an apparatus for depositing a layer on a substrate is provided. The apparatus includes a chamber adapted for layer deposition therein, a holding arrangement as described above within the chamber, and a deposition source for depositing material forming the layer.

[0011] According to yet another aspect, a method for conveying the above holding arrangement is provided. The method includes contacting, by at least one of the contact interfaces, at least one of the conveying rollers of the conveying system, and conveying the holding arrangement.

[0012]

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the invention and are described in the following:

FIG. 1 illustrates a holding arrangement according to embodiments described herein and with a substrate provided in a substrate area of the holding arrangement;

FIG. 2 illustrates another holding arrangement according to embodiments described herein and with a substrate provided in a substrate area of the holding arrangement;

FIG. 3 shows a detailed view of a system for conveying the holding arrangement according to embodiments described herein; FIG. 4 shows a view of an apparatus for depositing a layer of material on a substrate utilizing a holding arrangement according to embodiments described herein; and

FIG. 5 shows a flowchart of a method for conveying a holding arrangement according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

[0014] Reference will now be made in detail to the various embodiments of the invention, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the invention and is not meant as a limitation of the invention. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0015] Figure 1 illustrates a holding arrangement 10 or carrier according to embodiments described herein. The holding arrangement 10 for holding a substrate 20 during a vacuum process, e.g., vacuum layer deposition, includes a frame 30 having one or more frame elements, and one or more contact interfaces 50 provided at one or more of the frame elements and configured for contacting one or more conveying rollers of a conveying system. A Shore D hardness of a material of the one or more contact interfaces is in the range of 85 to 90. [0016] During conveying, abrasion or wear can occur at the contact areas of the carrier and the rollers. Because the Shore D hardness of the material of the one or more contact interfaces 50 is in the range of 85 to 90, particles generated during conveying are mechanically pressed into the material of the contact interfaces 50 (particle trap) and thus, a contamination effect during the deposition process is avoided. As a result, a quality of the deposited layers is improved. In other words, the material of the one or more contact interface 50 may be softer than a material of the conveying rollers, which are, for instance, made of metal, whereby particles generated during conveying are mechanically pressed into the material of the contact interfaces 50. [0017] According to some embodiments, which could be combined with other embodiments described herein, the Shore D hardness (HSD) of the material of the one or more contact interfaces is in the range of HSD 87 to 89, and particularly HSD 87 or HSD 89. As an example, the material of the one or more contact interfaces is PEEK, e.g. unreinforced PEEK, and the hardness thereof is about HSD 87. In another example, the material of the one or more contact interfaces is glass fibre reinforced PEEK, and the hardness thereof is about HSD 89.

[0018] The frame 30 is configured to support the substrate 20. Typically, the frame 30 may include one or more frame elements. In the example of figure 1, the frame 30 could include four frame elements, i.e., two vertically oriented frame elements and two horizontally oriented frame elements. In this example, the contact interface(s) 50 could be provided at at least one of the horizontal frame elements. However, the frame 30 of figure 1 could also include only one frame element, i.e., a rectangular shaped frame element.

[0019] According to some embodiments, the frame 30 defines an aperture opening for accommodating the substrate 20. For instance, the substrate 20 could be positioned within the aperture opening. As an example, the substrate 20 could be positioned within the aperture opening so as to cover the rims or edges thereof to avoid coating of said rims or edges. Accordingly, an edge exclusion mask can be provided by the frame of the carrier. According to some embodiments, a support surface for supporting at least a part of the edge regions of the substrate 20 is provided within the aperture opening. As an example, a cross section of the frame 30 could be L-shaped to provide the support surface. According to some embodiments, which could be combined with other embodiments described herein, the one or more frame elements include a polymer, plastic and/or metal. [0020] According to some embodiments, which could be combined with other embodiments described herein, a masking arrangement (not shown) is provided for covering the rims or edges of the substrate 20 to exclude said rims or edges from layer deposition. According to some embodiments, the frame 30 itself could serve as a masking arrangement or could provide additional masking.

[0021] According to some embodiments, which could be combined with other embodiments described herein, a Rockwell C hardness (HRC) of the conveying rollers is at least HRC 52. In typical embodiments, the hardness of the conveying rollers is in the range of HRC 52 to 61, and particularly in the range of HRC 53 to 60 or 53 to 59. As an example, the conveying rollers are hardened rollers (e.g., Cronidur), for instance with a hardness in the range of HRC 58 to 60. Thereby, most or even all of the particles generated during conveying are mechanically pressed into the material of the contact interfaces 50.

[0022] According to some embodiments, which could be combined with other embodiments described herein, the material hardness of the one or more contact interfaces 50 is less than a material hardness of the conveying rollers. Thereby, most or even all of the particles generated during conveying are mechanically pressed into the material of the contact interfaces 50.

[0023] The above hardness scales Shore D for the contact interfaces and Rockwell C for the conveying rollers are mere examples, and any suitable hardness scale could be used for the embodiments described herein. Particularly, regardless of the scale used, the material hardness of the one or more contact interfaces needs to be less than the material hardness of the conveying rollers, so that particles generated during conveying are mechanically pressed into the material of the contact interfaces. [0024] As an example, an indentation hardness could be considered (common indentation hardness scales are, e.g., Rockwell, Vickers, Shore, and Brinell). The indentation hardness measures the resistance of a sample to material deformation due to a constant compression load from a sharp object, e.g., an indenter piston. In such a test, the critical dimensions of an indentation left by a specifically dimensioned and loaded indenter are measured. According to the embodiments described herein, when performing such a test using the same indenter and the same compression load for the material of the contact interface and the material of the contact rollers, the critical dimension left by the indenter, e.g., an indentation depth, in the material of the contact interface are bigger/greater than the critical dimension (the indentation depth in this example) left by the indenter in the material of the conveying rollers. In other words, the material of the contact interface is softer than the material of the conveying rollers, or the material of the contact rollers is harder than the material of the contact interface.

[0025] According to some embodiments, which could be combined with other embodiments described herein, the material of the one or more contact interfaces 50 includes a polymer, plastic and/or metal, particularly, Polyetherketone, PEEK, PEEEK, glass fiber reinforced PEEK, unreinforced PEEK, and/or PEEKK. Thus, the contact interfaces 50 can be manufactured easily and cost effective.

[0026] According to some embodiments, which could be combined with other embodiments described herein, the one or more contact interfaces 50 include at least one of a material layer, a rod, a rail, and a bar. The example in figure 1 shows an embodiment where the contact interface 50 includes or is a material layer. In typical embodiments, the material layer is provided at the frame 30. As an example, the one or more frame elements include the material layer in an area where to the frame 30 is configured to contact the rollers of the conveying system, and may particularly include the material layer only in an area where to the frame 30 is configured to contact the rollers of the conveying system. In typical embodiments, one or more of the frame elements could at least partially be coated or laminated with the material layer. The material layer may be a thin film or a coating, for example having a thickness in the range of 100 to 300 μιη, and particularly about 200 μιη. [0027] In typical embodiments, the one or more frame elements and the one or more contact interfaces 50 are made of the same material. In other embodiments, the one or more frame elements and the one or more contact interfaces 50 are made of different materials. Thus, the contact interfaces 50 can be designed according to, e.g., process requirements or other considerations, such as a complexity factor of manufacturing or costs. [0028] According to some embodiments, which could be combined with other embodiments described herein, the one or more contact interfaces 50 are provided detachably from the one or more frame elements. As an example, the contact interfaces 50 could be exchanged or replaced when they are damaged or worn. [0029] According to some other embodiments, which could be combined with other embodiments described herein, the one or more frame elements and the one or more contact interfaces 50 are made of one piece. This allows an easy and cost effective production of the holding arrangement 10.

[0030] According to some embodiments, which could be combined with other embodiments described herein, the one or more contact interfaces 50 have a rounded, oval or rectangular shape. As an example, when the contact interface is a material layer, the frame element on which the contact interface 50 is provided (e.g., coated or laminated), may have the rounded, oval or rectangular shape, such that the material layer adopts the shape of the frame element(s). [0031] In typical embodiments, which could be combined with other embodiments described herein, the holding arrangement 10 is configured to hold a vertically oriented substrate 20. As an example, the contact interface 50 may be the only region or area of the holding arrangement 10 that contacts elements (such as the rollers) of the conveying system that move relatively with respect to said holding arrangement 10. Thereby, it can be ensured that most or even all particles generated during conveying are absorbed by the contact interface 50.

[0032] Figure 2 shows a holding arrangement 10 for holding the substrate 20 during a vacuum process according to other embodiments described herein.

[0033] The holding arrangement of figure 2 is similar to the holding arrangement of figure 1, the difference being that the contact interface 500 includes a rod, a rail, or a bar. The rod, rail, or bar may be referred to as "contact rod", "contact rail" and "contact bar", respectively. The terms "rod", "rail", and "bar" may include any elongated member or element that is suitable to serve as contact interface. In typical embodiments, the rod, rail or bar is provided at one or more of the frame elements and configured for contacting the one or more conveying rollers of the conveying system. In the example shown in figure 2, the rod, rail or bar is attached to the frame, e.g., by one or more connecting elements 501 such as connecting bridges.

[0034] According to some embodiments, which could be combined with other embodiments described herein, the rod, rail, or bar has a rounded, oval or rectangular cross section.

[0035] According to some embodiments, the rod, rail or bar is at least partially covered with the material layer described above with reference to figure 1. As an example, the rod, rail or bar may be made of a polymer, plastic and/or metal, and the material layer at least partially covering the rod, rail or bar may include the materials of the contact interface described above with reference to figure 1.

[0036] Figure 3 shows a detailed view of a system for conveying the holding arrangement 10 according to embodiments described herein.

[0037] The system for conveying the holding arrangement 10 includes the conveying rollers 60 configured to contact the one or more contact interfaces 500 of the holding arrangement 10 for conveying the holding arrangement 10.

[0038] The holding arrangement of figure 3 is similar to the holding arrangement of figure 2 in that the contact interface 500 includes a rod, a rail, or a bar. The rod, rail or bar is provided at one or more of the frame elements and configured for contacting the one or more conveying rollers 60 of the conveying system. In the example shown in figure 3, the rod, rail or bar is attached to the frame, e.g., by one or more connecting elements 501 such as connecting bridges.

[0039] According to some other embodiments, which could be combined with other embodiments described herein, the conveying rollers 60 include a recess 61. As an example, the recess 61 is configured to accommodate at least partially the contact interface 500. The contact interface 500 may be configured to engage the recess 61. In typical embodiments, the recess 61 is configured to guide the holding arrangement 10 during conveying. Although figure 3 shows an example where the contact interface 500 includes the rod, rail or bar, the present disclosure is not limited thereto. The holding arrangement in figure 3 could also be configured as the holding arrangement described with reference to figure 1.

[0040] According to different embodiments, a holding arrangement 10 can be utilized for PVD deposition processes, CVD deposition process, substrate structuring edging, heating (e.g. annealing) or any kind of substrate processing. Embodiments of holding arrangements 10 as described herein and methods of utilizing such holding arrangements 10 are particularly useful for non-stationary, i.e. continuous substrate processing of the vertically oriented large area glass substrates. Non-Stationary processing typically requires that the holding arrangement also provides masking elements for the process.

[0041] Figure 4 shows a schematic view of a chamber 600, e.g. a deposition chamber, according to embodiments. The chamber 600 is adapted for a deposition process, such as a PVD or CVD process. A substrate 20 is shown being located within or at a holding arrangement 10 or carrier according to embodiments described herein on a substrate transport device 620. A deposition source 630, e.g. material source or deposition material source, is provided in processing chamber 612 facing the side of the substrate 20 to be coated. The material source 630, e.g. the deposition material source, provides deposition material to be deposited on the substrate 20.

[0042] In figure 4, the deposition source 630 may be a target with deposition material thereon or any other arrangement allowing material to be released for deposition on substrate 20. Typically, the material source 630 may be a rotatable target. According to some embodiments, the deposition source 630 may be movable in order to position and/or replace the source. According to other embodiments, the material source may be a planar target. [0043] According to some embodiments, the deposition material may be chosen according to the deposition process and the later application of the coated substrate 20. For instance, the deposition material of the source 630 may be a material selected from the group consisting of: a metal, such as aluminum, molybdenum, titanium, copper, or the like, silicon, indium tin oxide, and other transparent conductive oxides. Typically, oxide-, nitride- or carbide-layers, which can include such materials, can be deposited by providing the material from the source or by reactive deposition, i.e. the material from the source reacts with elements like oxygen, nitride, or carbon from a processing gas. According to some embodiments, thin film transistor materials like siliconoxides, siliconoxynitrides, siliconnitrides, aluminumoxide or aluminumoxynitrides may be used as deposition materials.

[0044] Typically, the substrate 20 is provided within or at the holding arrangement 10 or carrier, which can also serve as an edge exclusion mask, particularly for non- stationary deposition processes. Dashed lines 665 show exemplarily the path of the deposition material during operation of the chamber. According to other embodiments, which can be combined with other embodiments described herein, the masking can be provided with a separate edge exclusion mask, which is provided in the processing chamber 612. Thereby, the holding arrangement 10 according to embodiments described herein can be beneficial for stationary processes and also for non- stationary processes. [0045] Figure 5 shows a flowchart of a method 100 for conveying a holding arrangement according to embodiments described herein.

[0046] The method 100 for conveying a holding arrangement includes contacting, by at least one of the contact interfaces, at least one of the conveying rollers of the conveying system (block 101), and conveying the holding arrangement (block 102). In typical embodiments, the holding arrangement is conveyed by a rotation of the rollers of the conveying system.

[0047] According to some embodiments, large area substrates may have a size of at least 0.174 m ² . Typically the size can be about 1.4 m 2 to about 8 m 2 , more typically about 2 m to about 9 m ² or even up to 12 m ² . Typically, the rectangular substrates, for which the holding arrangements according to embodiments described herein may be used, are large area substrates as described herein. For instance, a large area substrate can be GEN 5, which corresponds to about 1.4 m substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.39 m substrates (1.95 m x 2.25 m), GEN 8.5, which corresponds to about 5.5m ² substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.

[0048] Typically, the substrate may be made from any material suitable for material deposition. For instance, the substrate may be made from a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.

[0049] During conveying, abrasion or wear can occur at the contact areas between the carrier and the rollers. Because the Shore D hardness of the material of the one or more contact interfaces is in the range of 85 to 90, particles generated during conveying are mechanically pressed into the material of the contact interfaces and thus, a contamination effect during the deposition process is avoided. As a result, a quality of the deposited layers is improved.

[0050] While the foregoing is directed to embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.