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Title:
HOLE FORMING DEVICE, SUBSTRATE FOR PRINTED WIRING BOARD, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2007/138685
Kind Code:
A1
Abstract:
A hole forming device (100) has a first clamper (320) capable of moving work (W) in the x-axis direction, a second clamper (340) capable of moving work (W) in the x-axis direction, a support table (400) for supporting the first clamper (320) and the second clamper (340) and rotatable, a fine movement device (500) for finely moving the support table (400), a hole forming mechanism (600) for forming a through-hole (22) in the work (W), and imaging devices (710, 720) for imaging the work. The first clamper (320) and the second clamper (340) are constructed so that they can hold the work (W) independently from each other. The hole forming device (100) can perform hole forming work across the entire surface of the work (W), can form the through-hole (22) while highly accurately adjusting the position and attitude of the work (W), and is compact.

Inventors:
KATO KAZUHIKO (JP)
Application Number:
PCT/JP2006/310813
Publication Date:
December 06, 2007
Filing Date:
May 30, 2006
Export Citation:
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Assignee:
BEAC CO LTD (JP)
KATO KAZUHIKO (JP)
International Classes:
B26D7/02; B26D7/01; B26F1/32
Foreign References:
JP2001079622A2001-03-27
JP2000042989A2000-02-15
JPS62102994A1987-05-13
JPH0985693A1997-03-31
JPH07204994A1995-08-08
JPH0596413A1993-04-20
JPH0386498A1991-04-11
Attorney, Agent or Firm:
MATSUO, Nobutaka et al. (Intellectual Property ServicesNagano Branch, 9862-60, Ochiai,Fujimi-machi, Suwa-gu, Nagano 14, JP)
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