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Title:
HOLE PROCESSING METHOD AND HOLE PROCESSING TOOL
Document Type and Number:
WIPO Patent Application WO/2012/111526
Kind Code:
A1
Abstract:
A hole processing method and a hole processing tool, in which a first hole drilling tool (63a) which can process a hole having a smeller diameter than that of a mounting hole (60) that is an intended hole and a second hole drilling tool (63b) which can process a hole having the same diameter as that of the intended hole are used for achieving the hole processing in a tube plate (45) that is supported, and in which the following steps are involved: a temporary hole processing step of transferring the first hole drilling tool (63a) to a predetermined processing position to process a temporary hole (60A) having a predetermined depth; a hole measurement step of measuring the distance (S) between the mounting hole (60) that has been formed and the temporary hole (60A); a processing position correction step of correcting the processing position on the basis of the result of the measurement of the distance (S) between the mounting hole (60) and the temporary hole (60A); and an intended hole processing step of transferring the second hole processing tool (63b) to a corrected processing position to process the intended hole. In this manner, it becomes possible to achieve highly precise hole processing in a simple manner.

Inventors:
KASUBATA YOSHITAKE
OKAMOTO SHIGERU
SASAKI YUICHI
Application Number:
PCT/JP2012/052987
Publication Date:
August 23, 2012
Filing Date:
February 09, 2012
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
KASUBATA YOSHITAKE
OKAMOTO SHIGERU
SASAKI YUICHI
International Classes:
B23B39/08; B23B35/00
Foreign References:
JPS62184955U1987-11-25
JPS591108A1984-01-06
JPS6110265B21986-03-28
Other References:
See also references of EP 2676752A4
Attorney, Agent or Firm:
SAKAI, Hiroaki et al. (JP)
Hiroaki Sakai (JP)
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Claims: