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Patent Searching and Data


Title:
HOLE STRUCTURE AND PRODUCTION METHOD FOR HOLE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2001/071065
Kind Code:
A1
Abstract:
A hole structure having fine openings and drilled deep through holes, and a production method therefor. The hole structure is characterized by having through holes having first openings and second openings larger in size than the first openings, the size d of second openings being at least 2 $g(m)m and up to 50 $g(m)m, the depth t of through holes being larger than d and up to 15d. The production method is characterized by comprising the step of forming an opaque, conductive layer in a specified pattern on a transparent substrate, the step of forming a photosensitive, insoluble material layer on one opaque, conductive layer-formed surface of the transparent substrate, the step of exposing the photosensitive, insoluble material layer to light from the other surface, on which the opaque, conductive layer is not formed, of the transparent substrate, the step of developing the photosensitive, insoluble material to form a resist compatible with a specified pattern, and the step of forming a hole structure on one resist-formed surface by an electroplating method.

Inventors:
IKEDA TOMOO (JP)
Application Number:
PCT/JP2001/002305
Publication Date:
September 27, 2001
Filing Date:
March 22, 2001
Export Citation:
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Assignee:
CITIZEN WATCH CO LTD (JP)
IKEDA TOMOO (JP)
International Classes:
B41J2/14; B41J2/16; C25D1/08; D01D4/02; (IPC1-7): C25D1/08
Domestic Patent References:
WO1997046390A11997-12-11
Foreign References:
JPH11138827A1999-05-25
JPH11172487A1999-06-29
US5055163A1991-10-08
Other References:
See also references of EP 1199382A4
Attorney, Agent or Firm:
Ishida, Takashi (ISHIDA & ASSOCIATES Toranomon 37 Mori Bldg. 5-, Toranomon 3-chome Minato-ku Tokyo, JP)
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