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Title:
HOLED ELECTROLYTIC METALLIC FOIL, HOLED ELECTROLYTIC METALLIC FOIL WITH CARRIER BASE MATERIAL, AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2006/064741
Kind Code:
A1
Abstract:
Holed electrolytic metallic foils enabling, according to purposes, the designing of those parameters such as the size, shape, position, and depth of micro through holes and the quality of the micro through holes per unit area. The holed electrolytic metallic foil (1) is characterized by comprising the plurality of micro through holes (7) passed, when one surface side of the holed electrolytic metallic foil is taken as a reference plane, to other surface side so as to be positioned roughly vertical to the reference plane. The holed electrolytic metallic foil with a carrier base material is characterized in that the carrier base material and the holed electrolytic metallic foil are laminated on each other to improve the handling capability of the holed electrolytic metallic foil with the plurality of micro through holes in the thickness direction. A method of manufacturing these metallic foils is characterized in that an insulating projected part is formed on the surface of the carrier base material and metal plating is applied to the surface of the carrier base material on which the insulating projected part is formed to form the holed electrolytic metallic foil on the surface of the carrier base material.

Inventors:
SATO TETSURO (JP)
Application Number:
PCT/JP2005/022685
Publication Date:
June 22, 2006
Filing Date:
December 09, 2005
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO (JP)
SATO TETSURO (JP)
International Classes:
C25D1/10; C25D1/08; C25D1/22; H01M4/64; H01M8/02
Domestic Patent References:
WO2002024444A12002-03-28
Foreign References:
JP2003220364A2003-08-05
JPS60141887A1985-07-26
JPS4838835A1973-06-07
Attorney, Agent or Firm:
Yoshimura, Katsuhiro c/o Yoshimura International Patent Office (Omiya F bldg. 5-4, Sakuragicho 2-chome, Omiya-k, Saitama-shi Saitama 54, JP)
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