HOLLOW COMPONENT,HOLLOW COMPONENT MANUFACTURING METHOD, AND HOLLOW COMPONENT MANUFACTURING DEVICE

WIPO Patent Application WO/2023/008721

A1

Disclosed are a hollow component, a method for manufacturing a hollow component, and a device for manufacturing a hollow component. The method for manufacturing a hollow component according to an embodiment of the disclosure includes a first operation of molding a first injection-molded component, a second operation of molding a second injection-molded component, a third operation of causing the first injection-molded component and the second injection-molded component to face each other, a fourth operation of approaching the first injection-molded component and the second injection-molded component, and a fifth operation of coupling the first injection-molded component and the second injection-molded component. A fastening boss of the first injection-molded component is press-fitted into a fastening hole of the second injection-molded component in the fifth operation. Therefore, the fixation between the first injection-molded component and the second injection-molded component may be achieved without additional injection, and breakage and damage of the fastening boss and the fastening hole may be prevented.

RYU YEON SUN (KR)
JUNG KYONG HO (KR)
KIM SUNG GON (KR)
HONG LIN PYO (KR)
JEONG GWAN SIK (KR)

PCT/KR2022/007828

February 02, 2023

June 02, 2022

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LG ELECTRONICS INC (KR)

B29C65/56; B29C44/12; B29C45/00; B29C65/78

JPH10193972A	1998-07-28
KR20140047899A	2014-04-23
JP2018008399A	2018-01-18
JPH0716945A	1995-01-20
KR101675889B1	2016-11-14

NAM & NAM (KR)

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