Title:
HOLLOW PARTICLES, METHOD FOR PRODUCING SAID HOLLOW PARTICLES, RESIN COMPOSITION, AND RESIN MOLDED ARTICLE AND LAMINATE USING SAID RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/171859
Kind Code:
A1
Abstract:
Provided are hollow particles for improving dielectric properties. The hollow particles of the present invention include silica. The DSL of the primary particles satisfies formula (1), and the DST of the primary particles satisfies formula (2): 1 ≤ DSL ≤ 1.5 …(1), 1 ≤ DST ≤ 1.5 …(2). Here, DSL = D75L/D25L; D25L and D75L respectively show the 25th and 75th values when the long diameters of 100 randomly selected primary particles are measured in observation by scanning electron microscope and arranged in order of size from smallest; DST = D75T/D25T; and D25T and D75T respectively show the 25th and 75th values when the short diameters of 100 randomly selected primary particles are measured in observation by scanning electron microscope and arranged in order of size from smallest.
More Like This:
Inventors:
DAO NGUYEN DUY PHUONG (JP)
NAKAMURA TSUKASA (JP)
KUDO DAISUKE (JP)
NAKAMURA TSUKASA (JP)
KUDO DAISUKE (JP)
Application Number:
PCT/JP2021/002365
Publication Date:
September 02, 2021
Filing Date:
January 25, 2021
Export Citation:
Assignee:
KYOWA CHEM IND CO LTD (JP)
International Classes:
C01B33/18; B32B27/20; C08K3/105; C08K3/36; C08K7/26; C08L101/00
Foreign References:
| JP2017226567A | 2017-12-28 | |||
| JP2017501099A | 2017-01-12 | |||
| JP2007204293A | 2007-08-16 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
Download PDF: