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Patent Searching and Data


Title:
HOLLOW RESIN PARTICLE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/085189
Kind Code:
A1
Abstract:
Provided is a hollow resin particle which introduces a hollow region into a resin layer, which enables a reduction in dielectric properties and a reduction in dielectric loss tangent, and in which a hollow portion can be formed easily. Also provided is a method for producing this type of hollow resin particle in a simple manner. A hollow resin particle according to an embodiment of the present invention has a shell part and a hollow portion surrounded by the shell part. The shell part includes an aromatic polymer (P1) obtained by polymerizing a monomer composition containing an aromatic crosslinkable monomer (a), an aromatic monofunctional monomer (b) and a (meth)acrylic ester-based monomer (c) having a specific structure.

Inventors:
MATSUURA HARUHIKO (JP)
Application Number:
PCT/JP2020/039134
Publication Date:
May 06, 2021
Filing Date:
October 16, 2020
Export Citation:
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Assignee:
SEKISUI KASEI CO LTD (JP)
International Classes:
C08F255/00; B01J13/18; C08F2/20; C08F2/44; C08F212/06
Domestic Patent References:
WO2011040376A12011-04-07
WO2009112332A22009-09-17
WO2004067638A12004-08-12
Foreign References:
JP2016069619A2016-05-09
JP2000313818A2000-11-14
Other References:
OYO BUTURI, DIELECTRIC CONSTANT OF MIXED SYSTEMS, vol. 27, 1958
See also references of EP 4053180A4
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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