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Patent Searching and Data


Title:
HOLLOW RESIN PARTICLE AND SHEET
Document Type and Number:
WIPO Patent Application WO/2019/188996
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a hollow resin particle having higher compressive strength than a conventional particle and being excellent in a heat-insulating property and a heat-resisting property, and a sheet including the hollow resin particle. The hollow resin particle has one or more hollow portions, a number average particle diameter of 0.1 to 9.0 μm, and a porosity of 70% to 99%, and contains a volatile organic compound of 5% by mass or less.

Inventors:
IGA TAKASHI (JP)
HIRATA TAKESHI (JP)
YABUKI NOZOMI (JP)
Application Number:
JP2019/012530
Publication Date:
October 03, 2019
Filing Date:
March 25, 2019
Export Citation:
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Assignee:
ZEON CORP (JP)
International Classes:
C08F220/00; B41M5/42; C09D7/65; C09D201/00
Domestic Patent References:
WO2019026899A12019-02-07
Foreign References:
JP2010123348A2010-06-03
JP2016190980A2016-11-10
JP2008291165A2008-12-04
JP2013239246A2013-11-28
JPS5632513A1981-04-02
Attorney, Agent or Firm:
KISHIMOTO, Tatsuhito et al. (JP)
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