Title:
HOLLOW RESIN PLATE
Document Type and Number:
WIPO Patent Application WO/2018/079432
Kind Code:
A1
Abstract:
Provided is a hollow resin plate which ensures excellent handleability and which is unlikely to undergo deformation or white muddiness even when an edge of the hollow resin plate is subjected to a localized load exerted by a packing band, etc. A hollow resin plate 10 having a plurality of hollow parts 1a-1c in an planar direction is configured such that at least one end 2 thereof is formed to have a shape which has a vertically symmetric appearance and which has an arc-shaped cross-section at the upper edge and the lower edge in the thickness direction, and further that the ratio (2R/T) of a curvature diameter 2R (mm) at the upper and lower edges to a plate thickness T (mm) falls within the range represented by formula (I).
Inventors:
TAGUCHI YOSHINARI (JP)
Application Number:
PCT/JP2017/037997
Publication Date:
May 03, 2018
Filing Date:
October 20, 2017
Export Citation:
Assignee:
UBE EXSYMO CO LTD (JP)
International Classes:
B32B3/20; B32B3/04; B32B3/30
Domestic Patent References:
| WO2012049878A1 | 2012-04-19 |
Foreign References:
| JP2006103027A | 2006-04-20 | |||
| JP2009269219A | 2009-11-19 | |||
| JP2008143060A | 2008-06-26 | |||
| JPH06278203A | 1994-10-04 | |||
| JP2011183837A | 2011-09-22 | |||
| JP2007331389A | 2007-12-27 |
Attorney, Agent or Firm:
OMORI Keiko (JP)
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