Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HONEYCOMB STRUCTURE PACKING MATERIAL AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE PACKING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/221928
Kind Code:
A1
Abstract:
A honeycomb structure packing material is provided with a holding member (10) and a synthetic resin covering member (20) for covering the holding member (10), and holds honeycomb structures in recesses configured from a bottom surface and a circumferential surface. The recesses have recessed holding sections (13) provided in the holding member (10) and recessed covering sections provided in the covering member (20). The recessed covering sections have closely adhering sections (23) that adhere closely in surface contact with the recessed holding sections (13) and wrinkled sections (24) in which the covering member (20) is folded and formed in wrinkles.

Inventors:
OTSUKA MUTSUO (MX)
SAUCEDO ANTONIO (MX)
ANGUIANO ALEJANDRA (MX)
DE LUNA RAFAEL (MX)
Application Number:
PCT/JP2017/022687
Publication Date:
December 28, 2017
Filing Date:
June 20, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
IBIDEN MEXICO S A DE C V (MX)
IBIDEN CO LTD (JP)
International Classes:
B65D85/30; B65D81/05
Domestic Patent References:
WO2009057213A12009-05-07
WO2016013354A12016-01-28
Foreign References:
JP2014076816A2014-05-01
JPH0432902U1992-03-17
JP2012006638A2012-01-12
JP2005145500A2005-06-09
Attorney, Agent or Firm:
ONDA, Makoto et al. (JP)
Download PDF: