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Title:
HOT-DIP GALVANIZED STEEL SHEET AND GALVANNEALED STEEL SHEET OF EXCELLENT APPEARANCE AND PLATING ADHESIVENESS, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/037241
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a hot-dip galvanized steel sheet and a galvannealed steel sheet having a high Si content steel sheet as base material, having a beautiful appearance with no surface defects and excellent plating adhesiveness, and a manufacturing method therefor. A hot-dip galvanized steel sheet of excellent appearance and plating adhesiveness, the steel sheet being characterized in: having a component composition comprising, in mass%, 0.08% to less than 0.20% of C, 0.1-3.0% of Si, 0.5-3.0% of Mn, 0.001%-0.10% of P, 0.01%-3.00% of Al, and not more than 0.200% of S with the remainder being obtained from Fe and unavoidable impurities; having an internal oxidation layer with a thickness of not more than 5 μm on the ferrite side from the interface between the ferrite and the zinc-plating layer and a decarbonization layer with a thickness of not more than 20 μm on the ferrite side from the interface between the ferrite and the zinc-plating layer; and the internal oxidation layer comprising, in area ratio, at least 50% of a Fe- and/or Mn-containing Si oxide, which is represented by Fe2XMn2-2XSiOY, wherein X = 0 to 1, Y = 3 or 4.

Inventors:
TANAKA MINORU (JP)
SUZUKI YOSHITSUGU (JP)
NAGATAKI YASUNOBU (JP)
Application Number:
PCT/JP2014/004700
Publication Date:
March 19, 2015
Filing Date:
September 11, 2014
Export Citation:
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Assignee:
JFE STEEL CORP (JP)
International Classes:
C23C2/02; C22C38/00; C22C38/60; C23C2/06; C23C2/28; C21D9/56; C22C18/04
Domestic Patent References:
WO2013047739A12013-04-04
Foreign References:
JP2011214042A2011-10-27
JP2013014834A2013-01-24
JP2011117063A2011-06-16
JPH04202630A1992-07-23
JPH06306561A1994-11-01
JP2007291498A2007-11-08
Other References:
See also references of EP 3045558A4
Attorney, Agent or Firm:
KUMASAKA, Akira et al. (JP)
Akira Kumasaka (JP)
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