Title:
HOT FILLING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/085191
Kind Code:
A1
Abstract:
The purpose of the present invention is to improve the filling property of a hot filling material. The present invention provides a hot filling material comprising a binder and water both added to 100% by mass of a refractory raw material, wherein a basic raw material having a particle diameter of 1 mm or more and a basic raw material having a particle diameter of 20 μm or more and less than 106 μm are contained in amounts of 25 to 60% by mass inclusive and 5 to 25% by mass inclusive, respectively, relative to 100% by mass of the refractory raw material, and the content of a basic raw material having a particle diameter of less than 20 μm is 30% by mass or less (including 0) relative to 100% by mass of the refractory raw material.
Inventors:
HONDA KAZUHIRO (JP)
SHIRAMA NORIKAZU (JP)
AKAI SATOSHI (JP)
NAKAMICHI TSUBASA (JP)
OONO YOUSUKE (JP)
SHIRAMA NORIKAZU (JP)
AKAI SATOSHI (JP)
NAKAMICHI TSUBASA (JP)
OONO YOUSUKE (JP)
Application Number:
PCT/JP2019/040891
Publication Date:
April 30, 2020
Filing Date:
October 17, 2019
Export Citation:
Assignee:
KROSAKIHARIMA CORP (JP)
International Classes:
C04B35/66; F27D1/16
Foreign References:
| JP2009215096A | 2009-09-24 | |||
| JPS5595082A | 1980-07-18 | |||
| JP2008105890A | 2008-05-08 | |||
| JP2002160981A | 2002-06-04 | |||
| JPS6212676A | 1987-01-21 | |||
| JP2013063883A | 2013-04-11 |
Attorney, Agent or Firm:
EIWA PATENT FIRM (JP)
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