HOT-MELT ADHESIVE COMPOSITION HAVING ENHANCED COLD-TOLERANCE

Title:

HOT-MELT ADHESIVE COMPOSITION HAVING ENHANCED COLD-TOLERANCE

Document Type and Number:

WIPO Patent Application WO/2014/142599

Kind Code:

A1

Abstract:

The present invention relates to a hot-melt adhesive composition having improved cold-tolerance, and more particularly, to a hot-melt adhesive composition including an aliphatic polycarbonate resin obtained by the copolymerization of carbon dioxide and one or more different epoxide compounds, and a cold-tolerance enhancer.

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Inventors:

PARK JAE YOUNG (KR)
CHUNG KWANG JIN (KR)
HONG SEUNG GWEON (KR)

Application Number:

PCT/KR2014/002160

Publication Date:

September 18, 2014

Filing Date:

March 14, 2014

Export Citation:

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Assignee:

SK INNOVATION CO LTD (KR)
SK GLOBAL CHEMICAL CO LTD (KR)

International Classes:

C09J169/00; C09J175/04

Foreign References:

KR20120074954A	2012-07-06
KR20070051001A	2007-05-17
KR20070097488A	2007-10-04
KR20090112659A	2009-10-28
KR20070104290A	2007-10-25

Attorney, Agent or Firm:

KWON, Oh-Sig et al. (KR)
권오식 (KR)

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