Title:
HOT MELT ADHESIVE COMPOSITION AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/163693
Kind Code:
A1
Abstract:
The present invention provides a hot melt type adhesive composition which has a low viscosity when heated and melted and can advantageously form an adhesive layer. Provided is a hot melt type adhesive composition that contains a base polymer. The base polymer contains an acrylic polymer A and an acrylic polymer B. The acrylic polymer A is a polymer of a monomer component containing a (meth)acrylic monomer A having an alkyl group with 4-8 carbon atoms as a primary component. The acrylic polymer B is a polymer of a monomer component containing a (meth)acrylic monomer B having an alkyl group with 9-12 carbon atoms as a primary component. If the total amount of the acrylic polymer A and the acrylic polymer B in the base polymer is taken to be 100 wt%, the content of the acrylic polymer B is 10-90 wt%.
Inventors:
TAMURA AKINORI (JP)
HATANAKA ITSUHIRO (JP)
NEGISHI NOBUKAZU (JP)
HATANAKA ITSUHIRO (JP)
NEGISHI NOBUKAZU (JP)
Application Number:
PCT/JP2022/002867
Publication Date:
August 04, 2022
Filing Date:
January 26, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J11/06; C09J7/35; C09J7/38; C09J133/00; C09J133/08
Foreign References:
| JPH1036788A | 1998-02-10 | |||
| JP2018154811A | 2018-10-04 | |||
| JPH07173436A | 1995-07-11 | |||
| US4879178A | 1989-11-07 | |||
| JP2010509439A | 2010-03-25 | |||
| JPS5657865A | 1981-05-20 | |||
| JPS62149777A | 1987-07-03 | |||
| JP2018090802A | 2018-06-14 | |||
| JP2021014456A | 2021-02-12 | |||
| JP2013147655A | 2013-08-01 | |||
| JP2007051271A | 2007-03-01 |
Other References:
"Polymer Handbook", 1989, JOHN WILEY & SONS, INC.
Attorney, Agent or Firm:
OI, Michiko (JP)
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