Title:
HOT MELT ADHESIVE COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/065311
Kind Code:
A1
Abstract:
Provided is a hot melt adhesive composition, comprising: (a) from 30 to 45% by weight of at least one thermoplastic block copolymer; (b) from 0.1 to 5% by weight of at least one wax having a melting point of no less than 100℃; (c) from 5% to 20% by weight of at least one plasticizer; (d) from 20% to 55% by weight of at least one aliphatic tackifier; and (e) from 2% to 15% by weight of at least one aromatic tackifier, based on the total weight of the hot melt adhesive composition. Also provided is a use of the hot melt adhesive composition.
Inventors:
CHEN MINRUI (CN)
YANG FAN (CN)
YANG FAN (CN)
Application Number:
PCT/CN2021/125743
Publication Date:
April 27, 2023
Filing Date:
October 22, 2021
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
HENKEL CHINA INVEST CO LTD (CN)
HENKEL CHINA INVEST CO LTD (CN)
International Classes:
C08K5/18; C09J153/02; C08K5/36; C08K5/524; C08L53/00; C08L53/02; C08L91/06; C09J11/06; C09J153/00; C09J191/06
Foreign References:
| CN107109173A | 2017-08-29 | |||
| CN113330088A | 2021-08-31 | |||
| CN1970670B | 2012-08-08 | |||
| US6034159A | 2000-03-07 | |||
| CN102277112A | 2011-12-14 | |||
| US20160068721A1 | 2016-03-10 | |||
| CN101331203B | 2012-04-25 |
Attorney, Agent or Firm:
NTD PATENT & TRADEMARK AGENCY LIMITED (CN)
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