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Title:
HOT MELT ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/060224
Kind Code:
A1
Abstract:
 Provided are an adhesive composition suited for use as a hot melt adhesive that has low initial tack, and that after adhesion to an adherend, has ample adhesive strength through heat treatment; and an adhesive product employing the adhesive composition. This hot melt adhesive composition contains an acrylic block copolymer (I) having at least one polymer block (A) comprising methacrylic acid ester units and at least one polymer block (B) comprising acrylic acid ester units, wherein the acrylic acid ester units constituting the polymer block (B) comprise an acrylic acid ester (1) represented by the general formula CH2=CH-COOR1 (1) (wherein R1 represents a C1-3 alkyl group) and an acrylic acid ester (2) represented by the general formula CH2=CH-COOR2 (2) (wherein R2 represents a C4-12 alkyl group), the mass ratio (1)/(2) of the acrylic acid ester (1) and the acrylic acid ester (2) being 90/10-25/75.

Inventors:
NAKADA KANAYO (JP)
KAWAHARA MOE (JP)
MORISHITA YOSHIHIRO (JP)
Application Number:
PCT/JP2014/077777
Publication Date:
April 30, 2015
Filing Date:
October 20, 2014
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
C09J153/00; C08F297/02; C09J7/22; C09J7/35; C09J133/00; C09J133/08
Foreign References:
JP2006511640A2006-04-06
JP2012207155A2012-10-25
JP2003105300A2003-04-09
JP2001200026A2001-07-24
JPH09324165A1997-12-16
JP2000119619A2000-04-25
JP2010536969A2010-12-02
JP2013163821A2013-08-22
JP2009256497A2009-11-05
JP2004204231A2004-07-22
JP2002513164A2002-05-08
JP2006511640A2006-04-06
JP2006117932A2006-05-11
JPH0693060A1994-04-05
JPH05507737A1993-11-04
JPH11335432A1999-12-07
Other References:
MACROMOLECULAR CHEMISTRY AND PHYSICS, vol. 201, 2000, pages 1108 - 1114
"POLYMER HANDBOOK", vol. VII, 1999, WILEY INTERSCIENCE, pages: 675 - 714
POLYMER ENGINEERING AND SCIENCE, vol. 14, 1974, pages 147 - 154
See also references of EP 3061798A4
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
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