Title:
HOT MELT ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/246063
Kind Code:
A1
Abstract:
A hot melt adhesive composition containing a 1–butene homopolymer, an ethylenic polymer having a melting point of less than 80°C, an α–olefin copolymer having a melting point of at least 80°C, an adhesion-imparting resin, a wax, and a liquid softening agent. The ethylenic polymer includes at least one type of copolymer selected from the group consisting of an ethylene·α－olefin copolymer and an ethylene·vinyl acetate copolymer.
Inventors:
TAKAHASHI YUZURU (JP)
Application Number:
PCT/JP2019/049936
Publication Date:
December 10, 2020
Filing Date:
December 19, 2019
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B32B27/28; B32B27/32; C09J11/08; C09J123/08; C09J123/10; C09J123/20; C09J131/04; C09J191/06
Domestic Patent References:
| WO2018179609A1 | 2018-10-04 | |||
| WO2017061061A1 | 2017-04-13 |
Foreign References:
| JP2004284575A | 2004-10-14 | |||
| JP2009126991A | 2009-06-11 | |||
| JP2019011422A | 2019-01-24 | |||
| JP2018076454A | 2018-05-17 | |||
| JP2001523285A | 2001-11-20 | |||
| JP2017538803A | 2017-12-28 | |||
| JP2005290339A | 2005-10-20 | |||
| JP2013216724A | 2013-10-24 | |||
| JP2004284575A | 2004-10-14 |
Other References:
See also references of EP 3964362A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
Previous Patent: OPTICAL FILM PRODUCTION METHOD, AND OPTICAL FILM PRODUCTION DEVICE
Next Patent: POSITIVE ELECTRODE ACTIVE MATERIAL, AND CELL
Next Patent: POSITIVE ELECTRODE ACTIVE MATERIAL, AND CELL