HOT MELT ADHESIVE COMPOSITIONS - MITSUI CHEMICALS INC

Title:

HOT MELT ADHESIVE COMPOSITIONS

Document Type and Number:

WIPO Patent Application WO/1998/033861

Kind Code:

A1

Abstract:

A hot melt adhesive composition comprising 100 parts by weight of a tackifier (B) and 1 to 900 parts by weight of an $g(a)-olefin/aromatic vinyl random copolymer (C); another hot melt adhesive composition comprising 100 parts by weight of a base polymer (A), 1 to 900 parts by weight of the component (B) and 1 to 1000 parts by weight of the component (C); and still another hot melt adhesive composition comprising 100 parts by weight of the component (A), 10 to 300 parts by weight of the component (B) and 10 to 400 parts by weight of the component (C). The component (A) is preferably at least one polymer selected from the group consiting of (a-1) polyolefins, (a-2) polymers having polar groups and (a-3) aromatic vinyl/conjugated diene copolymers. These adhesive compositions are excellent in adhesive strength and usable also as adhesives for styrene resins.

Inventors:

MORIZONO KENICHI (JP)
OKADA KEIJI (JP)
TOKITA SUGURU (JP)

Application Number:

PCT/JP1998/000211

Publication Date:

August 06, 1998

Filing Date:

January 21, 1998

Export Citation:

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Assignee:

MITSUI CHEMICALS INC (JP)
MORIZONO KENICHI (JP)
OKADA KEIJI (JP)
TOKITA SUGURU (JP)

International Classes:

C09J109/06; C09J123/08; C09J125/02; C09J125/08; C09J151/06; C09J153/00; C09J153/02; C08L23/02; C08L23/06; C08L23/08; C08L53/02; C08L91/06; (IPC1-7): C09J123/00; C09J109/06; C09J125/00; C09J153/02; C09J201/00

Foreign References:

JPH041288A	1992-01-06
JPH04255779A	1992-09-10
JPS63213586A	1988-09-06
JPH01144483A	1989-06-06

Other References: