Title:
HOT MELT ADHESIVE FILM FOR BONDING ETHYLENE PROPYLENE DIENE MONOMER RUBBER
Document Type and Number:
WIPO Patent Application WO/2021/051980
Kind Code:
A1
Abstract:
A hot melt adhesive film for bonding ethylene propylene diene monomer (EPDM) rubber. The hot melt adhesive film is formed by 30-65 parts of a polyolefin resin, 15-45 parts of a tackifying resin, 3-12 parts of a functional filler, 3-10 parts of a curing agent and 1-5 parts of an auxiliary adhesive being mixed and undergoing screw extrusion molding. The described hot melt adhesive film is used to bond EPDM rubber, the adhesive force thereof is strong and strengthening treatment is not required, thus the described hot melt adhesive film can meet the adhesive peeling force requirements of automotive industry standards. In addition, the film is easy to use, and when in use, EPDM rubber does not need to be cleaned by using a solvent or be treated by using a primer, and the EPDM rubber is directly composite bonded at a high temperature after same is vulcanized, thus greatly improving the production efficiency of mass production.
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Inventors:
WANG XUEGANG (CN)
CAI XIUJUAN (CN)
CAI XIUJUAN (CN)
Application Number:
PCT/CN2020/102277
Publication Date:
March 25, 2021
Filing Date:
July 16, 2020
Export Citation:
Assignee:
CHANGZHOU CHIKE PHOTOELECTRICITY TECH CO LTD (CN)
International Classes:
C09J7/35; B32B7/12; B32B25/08; C09J7/10; C09J11/04; C09J11/08; C09J123/14
Foreign References:
| CN110484161A | 2019-11-22 | |||
| CN105419664A | 2016-03-23 | |||
| CN103694909A | 2014-04-02 | |||
| CN105969248A | 2016-09-28 | |||
| CN103694908A | 2014-04-02 | |||
| CN108587536A | 2018-09-28 | |||
| US20170226388A1 | 2017-08-10 |
Attorney, Agent or Firm:
WUXI HUICHENGYONGXIN PATENT FIRM( GENERAL PARTNERSHIP) (CN)
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