Title:
HOT-MELT ADHESIVE RESIN FILM AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2017/037525
Kind Code:
A1
Abstract:
The present invention pertains to: a hot-melt adhesive resin film that, with respect to a variety of flat or film-shaped adherends made of metal, glass, plastic, or the like, does not develop peeling between layers and has excellent adhesive strength, and that has strong durability even in harsh durability assessments; and to a method for producing same. More specifically, the present invention pertains to: a hot-melt adhesive resin film characterized by being obtained by layering a first adhesive layer, a first interlayer, a thermostable base material layer, a second interlayer, and a second adhesive layer, in the stated order, the first adhesive layer and the second adhesive layer containing an acid-modified polyolefin resin; and to a method for producing same.
Inventors:
TAKEI KUNIHIRO (JP)
MARUYAMA YUIKO (JP)
IIZUKA HIROKAZU (JP)
MARUYAMA YUIKO (JP)
IIZUKA HIROKAZU (JP)
Application Number:
PCT/IB2016/001087
Publication Date:
March 09, 2017
Filing Date:
August 03, 2016
Export Citation:
Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
B32B27/00; B32B27/32; B32B27/38; C09J7/29; C09J7/35; C09J123/26; C09J125/08; C09J163/00
Foreign References:
| JPH10138418A | 1998-05-26 | |||
| JP2013091702A | 2013-05-16 | |||
| JP2014218633A | 2014-11-20 | |||
| JPH1076618A | 1998-03-24 | |||
| JPH04197633A | 1992-07-17 | |||
| JP2016122619A | 2016-07-07 |
Other References:
See also references of EP 3333234A4
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