Title:
HOT MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2012/092233
Kind Code:
A8
Abstract:
The present invention provides a hot melt adhesive which is applicable at a low temperature, is excellent in heat resistance and shows a suitable long open time. Moreover, the present invention provides a paper product produced by using the hot melt adhesive. The present hot melt adhesive comprising (A) an ethylene-based copolymer and (B) a wax, wherein (B) the wax comprises (Bl) a carboxylic acid or carboxylic acid anhydride- modified olefin copolymer wax, is applicable at a low temperature, is excellent in heat resistance and shows a suitable long open time. Furthermore, a paper product produced by using the present hot melt adhesive is provided.
Inventors:
TAKAMORI AI (JP)
Application Number:
PCT/US2011/067324
Publication Date:
December 05, 2013
Filing Date:
December 27, 2011
Export Citation:
Assignee:
HENKEL CORP (US)
TAKAMORI AI (JP)
TAKAMORI AI (JP)
International Classes:
C09J123/00; C09J7/21; C09J7/30; C09J123/08
Attorney, Agent or Firm:
LEHMANN, Sun, Hee (10 Finderne AvenueBridgewater, NJ, US)
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